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HomeMaterials Science ForumMaterials Science Forum Vols. 133-136KET - A PC Package for Structure and Substructure...

KET - A PC Package for Structure and Substructure Investigations

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Periodical:

Materials Science Forum (Volumes 133-136)

Pages:

293-296

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.133-136.293

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Online since:

January 1993

Authors:

V.A. Kogan

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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