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HomeMaterials Science ForumMaterials Science Forum Vols. 163-165Mechanical and Electrical Properties of...

Mechanical and Electrical Properties of Co-Deposited and Multilayer Copper-Tungsten Films

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Periodical:

Materials Science Forum (Volumes 163-165)

Pages:

551-558

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.163-165.551

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Online since:

May 1994

Authors:

D.P. Monaghan, T. Hirst, D. Cross, R.D. Arnell

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© 1994 Trans Tech Publications Ltd. All Rights Reserved

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