Mechanical and Electrical Properties of Co-Deposited and Multilayer Copper-Tungsten Films

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Periodical:

Materials Science Forum (Volumes 163-165)

Edited by:

E.J. Mittemeijer

Pages:

551-558

DOI:

10.4028/www.scientific.net/MSF.163-165.551

Citation:

D.P. Monaghan et al., "Mechanical and Electrical Properties of Co-Deposited and Multilayer Copper-Tungsten Films ", Materials Science Forum, Vols. 163-165, pp. 551-558, 1994

Online since:

May 1994

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$35.00

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