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HomeMaterials Science ForumMaterials Science Forum Vols. 204-206Grain Growth Behavior during Static...

Grain Growth Behavior during Static Recrystallization of 3%-Silicon Steel Following High Temperature Deformation

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Grain Growth in Polycrystalline Materials II

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Periodical:

Materials Science Forum (Volumes 204-206)

Pages:

533-538

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.204-206.533

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Online since:

March 1996

Authors:

Mineo Muraki, Y. Ozaki, M. Hisata, T. Obara, T. Kan

Keywords:

Subgrains, Electrical Steel, Electron Channeling Pattern, Grain Growth Rate, Orientation, Recovery, Site Saturation, Static Recrystallization

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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