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HomeMaterials Science ForumMaterials Science Forum Vols. 299-300Evaluation of Binder Burnout by Thermal Analysis

Evaluation of Binder Burnout by Thermal Analysis

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Periodical:

Materials Science Forum (Volumes 299-300)

Pages:

439-447

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.299-300.439

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Online since:

December 1998

Authors:

Daniel Rodrigues, André Paulo Tschiptschin

Keywords:

Debinding, Powder Injection Molding (PIM)

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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