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HomeMaterials Science ForumMaterials Science Forum Vols. 308-311Powder Metallurgical Processing and Properties of...

Powder Metallurgical Processing and Properties of Copper/Tungsten Gradients

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Functionally Graded Materials

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Periodical:

Materials Science Forum (Volumes 308-311)

Pages:

766-773

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.308-311.766

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Online since:

May 1999

Authors:

U. Birth, M. Joensson, B. Kieback

Keywords:

Concentration Profile, CPF, Hardness Profile, Layer Combination, Microstructure, Powder Processing, Stress Profile, W/Cu-Gradient

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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