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HomeMaterials Science ForumMaterials Science Forum Vols. 329-330Analytical Modelling of Solidification during...

Analytical Modelling of Solidification during Temperature Gradient TLP Diffusion Bonding

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Abstract:

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Solidification and Gravity III

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Periodical:

Materials Science Forum (Volumes 329-330)

Pages:

351-360

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.329-330.351

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Online since:

January 2000

Authors:

A.A. Shirzadi, E.R. Wallach

Keywords:

Aluminum (Al), Diffusion Bonding (DB), Joining, Modeling, Temperature Gradient, Theory, Transient Liquid Phase

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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