Analytical Modelling of Solidification during Temperature Gradient TLP Diffusion Bonding

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Periodical:

Materials Science Forum (Volumes 329-330)

Edited by:

A. Roósz, M. Rettenmayr, D. Watring

Pages:

351-360

DOI:

10.4028/www.scientific.net/MSF.329-330.351

Citation:

A.A. Shirzadi and E.R. Wallach, "Analytical Modelling of Solidification during Temperature Gradient TLP Diffusion Bonding", Materials Science Forum, Vols. 329-330, pp. 351-360, 2000

Online since:

January 2000

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$35.00

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