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HomeMaterials Science ForumMaterials Science Forum Vols. 408-412Recrystallization Texture of a Copper...

Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation

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Textures of Materials - ICOTOM 13

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Periodical:

Materials Science Forum (Volumes 408-412)

Pages:

895-900

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.408-412.895

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Online since:

August 2002

Authors:

Soo Young Kang, Dong Nyung Lee

Keywords:

Copper (Cu), Deposition Textures, Electro-Deposition, Recrystallization Textures

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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