Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation

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Periodical:

Materials Science Forum (Volumes 408-412)

Edited by:

Dong Nyung Lee

Pages:

895-900

DOI:

10.4028/www.scientific.net/MSF.408-412.895

Citation:

S. Y. Kang and D. N. Lee, "Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation", Materials Science Forum, Vols. 408-412, pp. 895-900, 2002

Online since:

August 2002

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$35.00

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