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HomeMaterials Science ForumMaterials Science Forum Vols. 423-425Thermal Stress Simulation in TiB2-Cu Functionally...

Thermal Stress Simulation in TiB₂-Cu Functionally Graded Materials

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Functionally Graded Materials VII

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Periodical:

Materials Science Forum (Volumes 423-425)

Pages:

245-248

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.423-425.245

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Online since:

May 2003

Authors:

Xue Bing Wang, Xing Hong Zhang, Shan Yi Du

Keywords:

Steady State, Thermal Stress Simulation, Transient State

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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