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HomeMaterials Science ForumMaterials Science Forum Vols. 423-425Bonding of Copper to Aluminum Nitride Substrate...

Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer

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Functionally Graded Materials VII

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Periodical:

Materials Science Forum (Volumes 423-425)

Pages:

301-304

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.423-425.301

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Online since:

May 2003

Authors:

Sheng Qiang Bai, Li Dong Chen, A. Yamamura

Keywords:

Active Interlayer, Adhesion Strength, AlN Substrates, Bonding

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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