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HomeMaterials Science ForumMaterials Science Forum Vols. 423-425Design and Thermal Shock Performance of W/Cu...

Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component

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Functionally Graded Materials VII

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Periodical:

Materials Science Forum (Volumes 423-425)

Pages:

49-54

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.423-425.49

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Online since:

May 2003

Authors:

Yun Han Ling, Xin De Bai, Chang Chun Ge

Keywords:

Finite Element Analysis (FEA), Plasma Facing Material, Thermal Stress, Tungsten

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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