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Transient Liquid Phase Bonding of Intermetallic Compounds

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

1891-1896

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.1891

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Online since:

August 2003

Authors:

W.F. Gale

Keywords:

Joining, Mechanical Property, Microstructure, NiAl, Structural Intermetallic Compounds, TiAl, Transient Liquid Phase (TLP) Bonding, Wettability

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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