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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Novel Electronic Packages Made of Highly Loaded...

Novel Electronic Packages Made of Highly Loaded SiC Particle Aluminium Based Composites for Space Applications

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

2151-2156

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.2151

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Online since:

August 2003

Authors:

J. Coleto, J. Maudes, Javier Goñi, J. Marcos, J. Calvín, F. Costas

Keywords:

Aluminum Matrix Composite (AMC), Low-Noise-Amplifier (LNA), Metal Matrix Composite (MMC), Monolithic Microwave Integrated Circuits MMICs, Solid State Power Amplifier SSPA

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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