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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Evaluation of Ligand Binding to Type 1 Collagen...

Evaluation of Ligand Binding to Type 1 Collagen through Computational and Analytical Methods

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

3061-3066

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.3061

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Online since:

August 2003

Authors:

J. Vaidyanathan, T.K. Vaidyanathan, S. Ravichandran, Barry M. Klein

Keywords:

Binding Assay, Collagen-Ligand Interaction, Computer Modeling, Thermoanalytical Assay

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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