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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Microstructures at Aluminum - Copper Magnetic...

Microstructures at Aluminum - Copper Magnetic Pulse Weld Interfaces

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

4001-4006

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.4001

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Online since:

August 2003

Authors:

Manuel Marya, Didier Priem, Surendar Marya

Keywords:

Aluminum (Al), Copper (Cu), Intermetallic Phase, Magentic Pulse Welding, Magnetic Pulse Welding, Melting

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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