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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Jointing Structures of Some Kinds of Lead-Free...

Jointing Structures of Some Kinds of Lead-Free Solder on EN/IG Finished Boards

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

4117-4122

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.4117

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Online since:

August 2003

Authors:

Takashi Sugizaki, Hidehiro Nakao, Tohru Watanabe

Keywords:

Interfacial Reaction, Jointing Structure, Lead-Free Solder, Plating

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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