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HomeMaterials Science ForumMaterials Science Forum Vols. 447-448Application Studies of New Process and Material...

Application Studies of New Process and Material for Low-Cost SPF/DB Panel Forming Technology

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Superplasticity in Advanced Materials - ICSAM 2003

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Periodical:

Materials Science Forum (Volumes 447-448)

Pages:

277-282

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.447-448.277

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Online since:

February 2004

Authors:

Shinichi Yajima, M. Shimanuki, Toshimichi Ogisu, Shigeru Kimura, Hideto Oyama

Keywords:

Diffusion Bonding (DB), Forming Method, Forming Simulation, Super Plastic Forming (SPF), Ti-9, Titanium (Ti)

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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