Effects of Silicon and Chromium on the SCC Properties of Al-Zn-Mg-Cu Cast Alloy

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Abstract:

Effects of Si and Cr additions and aging treatment on the stress corrosion cracking(SCC) resistance of Al-Zn-Mg-Cu cast alloys were investigated by C-ring test and electrical conductivity measurement. The SCC resistance of Al-Zn-Mg-Cu cast alloys decreased in the order of Cr containing alloy, Si containing alloy and base alloy. The lowest electrical conductivity of Cr containing alloy exhibited the best SCC resistance and this is probably due to an improved corrosion resistance by forming a passive film on the surface. The over-aged alloys showed the better SCC resistance. This is due to the increased distance between coarse particles at grain boundary. The fracture mode of the alloy was confirmed as intergranular type and showed brittle fracture surface. The SCC mechanism of Al-Zn-Mg-Cu cast alloys was found to be the anodic dissolution model.

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Periodical:

Materials Science Forum (Volumes 449-452)

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585-588

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March 2004

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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[1] B. A. Kolachev, V. Y. Elagin and V. A. Livanov : Physical Metallurgy and Heat Treatment of the Nonferrous Metal and Alloys (MISIS, Russia 2001).

Google Scholar

[2] J. C. Beddoes and M. C. Demalherbe, Can. Aeronaut. Space, J., Vol. 27 (1981), p.222.

Google Scholar

[3] D. Thevenet, M. Miha-Touau and A. Zeghloul, Mater. Sci. Eng. Vol. A266 (1999), p.176.

Google Scholar

[4] D. A. Jones : Principles and Prevention of Corrosion (Prentice Hall, USA 1997).

Google Scholar

[5] K. N. Kim, K. H. Kim and I. B. Kim, Kor. J. Mater. Res., Vol. 12 (2002), p.436.

Google Scholar

[6] P. N. Adler, R. DeIasi and G. Gecshwind, Metall. Trans., Vol. 3 (1972), p.3191.

Google Scholar

[7] J. W. Choi, J. K. Kim and I. B. Kim, Kor. J. Mater. Res., Vol. 9 (1999), p.695.

Google Scholar

[8] C. H. Lee, K. H. Kim and I. B. Kim, Kor. J. Mater. Res., Vol. 11 (2001), p.266.

Google Scholar