Modelling of Solid-State Diffusion Bonding with a Real Rough Surface

G.Q. Wu; Z. Huang; Han Yun Li

doi:10.4028/www.scientific.net/MSF.475-479.3185

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Effect of Austenite Grain Size on Martensitic Transformation of a Low Alloy Steel
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FE Simulation of Grain Size during the Isothermal Forging of a TC6 Titanium Alloy Disc
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Study for Step Instabilities Induced by ES Barrier
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Modelling of Solid-State Diffusion Bonding with a Real Rough Surface
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The Ground States of the FCC Alloy Films
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Suppression of Anomalous Interface Effects by Localization of Solute Redistribution in Thin Interface Phase-Field Modeling of Solidification
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Numerical Simulation on the Solidification of ZA27 Alloy by a Two-Phase Flow Model
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Study on Effect of Technical Parameter on Fluid Flow and Solidification in Steel Strip Roll-Casting Process
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HomeMaterials Science ForumMaterials Science Forum Vols. 475-479Modelling of Solid-State Diffusion Bonding with a...

Modelling of Solid-State Diffusion Bonding with a Real Rough Surface

Abstract:

By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The model, reflecting the characteristic of real bonding process effectively, realizes the visualization and simulation of the bonding process in which many voids disappear dynamically. The results show that the simulation is close to those experimental results from the phenomena of voids closure.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

3185-3188

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.3185

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Online since:

January 2005

Authors:

G.Q. Wu, Z. Huang, Han Yun Li

Keywords:

Computer Based Simulation, Diffusion, Diffusion Bonding (DB), Rough Surface

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References

[1] C. H. Hamilton: Titannium Science and Technology. New York Plenum Vol. 1 (1973), p.625.

Google Scholar

[2] G. Garmong, et al: Attainment of full interfacial contact during diffusion bonding. Metallurgical Trans Vol. 6 (1975), p.1268.

DOI: 10.1007/bf02658537

Google Scholar

[3] J. Pilling, et al: Modeling solid-state diffusion bonding. Acta Metall Vol. 37 (1989), p.2425.

Google Scholar

[4] B. Derby, et al: Theoretical model for diffusion bonding. Metal Science Vol. 16（1982）: 49-5.

Google Scholar

[5] B. Derby, et al: Diffusion bonding: development of theoretical model. Metal Science Vol. 18 (1984), p.427.

Google Scholar

[6] A. Hill, et al: Modeling solid-state diffusion bonding. Acta Metall Vol. 37 (1989), p.2425.

Google Scholar

[7] Wen Shizhu: The principle of tribology. (Publishing Company of Tsinghua University, Beijing, 1991).

Google Scholar

[8] D. S. Wilkinson and M. F. Ashby: Science of Sintering Vol. 10 (1978), p.67.

Google Scholar

[9] E. Arzt: Interface Controlled diffusion creep. Acta Metallurgica Vol. 31 (1983), p. (1977).

Google Scholar

[10] J. R. Williamson: Welding Technology for the Aerospace Industry, Proceedings of the Conference, Los Angeles: AWS. (1981), pp.55-88.

Google Scholar

[11] W. W. Mullins: Metal surfaces. ASM. (1963), p.17.

Google Scholar