Modelling of Solid-State Diffusion Bonding with a Real Rough Surface

Abstract:

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By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The model, reflecting the characteristic of real bonding process effectively, realizes the visualization and simulation of the bonding process in which many voids disappear dynamically. The results show that the simulation is close to those experimental results from the phenomena of voids closure.

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

3185-3188

DOI:

10.4028/www.scientific.net/MSF.475-479.3185

Citation:

G.Q. Wu et al., "Modelling of Solid-State Diffusion Bonding with a Real Rough Surface", Materials Science Forum, Vols. 475-479, pp. 3185-3188, 2005

Online since:

January 2005

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Price:

$35.00

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