Processing and Microstructures of Tungsten/Copper Composites Produced by Plasma Spray and Cold Spray

Suk Bong Kang; Hyun-Ki Kang; Kwang Jun Euh

doi:10.4028/www.scientific.net/MSF.475-479.945

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HomeMaterials Science ForumMaterials Science Forum Vols. 475-479Processing and Microstructures of Tungsten/Copper...

Processing and Microstructures of Tungsten/Copper Composites Produced by Plasma Spray and Cold Spray

Abstract:

Tungsten/copper composites were produced using an agglomerated feedstock powder by plasma spray and cold spray. In the case of the plasma spray, the external feedstock injection (EFI) and the internal feedstock injection (IFI) were adopted to compare oxidation, microstructure, porosity, and tungsten recovery in the deposits. The IFI deposit had less oxidation, denser microstructure, and more tungsten retention compared to the EFI. Especially, more tungsten particles were melted from the IFI than from the EFI at input power of 25kW. Thermal expansion coefficient of plasma sprayed composite (72W/28Cu vol.%) was approximately 5.2x10-6/K. In the cold spray, no oxidation and more dense microstructures were observed with porosity of less than 1.0 vol.%. However lots of tungsten was lost due to insufficient plastic deformation.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

945-948

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.945

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Online since:

January 2005

Authors:

Suk Bong Kang, Hyun-Ki Kang, Kwang Jun Euh

Keywords:

Cold Spray, Electronic Packaging, Plasma Spraying, Tungsten/Copper Composite

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