3D Coupled Thermomechanical Finite Element Analysis of Ultrasonic Consolidation

C.J. Huang; E. Ghassemieh

doi:10.4028/www.scientific.net/MSF.539-543.2651

Paper Titles

Multifield Potentials and Derivation of Extremum Principles in Rate Plasticity
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Consolidation and Mechanical Properties of Gas Atomized Al-Si Powder
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Powder Injection Molding of Ti6Al4V Alloy
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Effects of Alloying Elements on the Sintering and Heat Treatment of Elementally Mixed Aluminum Powder Alloys
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3D Coupled Thermomechanical Finite Element Analysis of Ultrasonic Consolidation
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Investigation of Sintering of Spherical Copper Powder by Micro Focus Computed Tomography (μCT) and Synchrotron Tomography
p.2657

Difficulties with Ti-Ni Powder Metallurgy Process and Multi-Stage Sintering Technique for TiNi SMA
p.2663

Prealloyed Cu-Fe Powder Materials
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Development of Pre-Alloyed Powders for Diamond Tools and their Characteristics
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HomeMaterials Science ForumMaterials Science Forum Vols. 539-5433D Coupled Thermomechanical Finite Element...

3D Coupled Thermomechanical Finite Element Analysis of Ultrasonic Consolidation

Abstract:

A 3-D coupled temperature-displacement finite element analysis is performed to study an ultrasonic consolidation process. Results show that ultrasonic wave is effective in causing deformation in aluminum foils. Ultrasonic vibration leads to an oscillating stress field. The oscillation of stress in substrate lags behind the ultrasonic vibration by about 0.1 cycle of ultrasonic wave. The upper foil, which is in contact with the substrate, has the most severe deformation. The substrate undergoes little deformation. Apparent material softening by ultrasonic wave, which is of great concern for decades, is successfully simulated. The higher the friction coefficient, the more obvious the apparent material softening effect.

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Periodical:

Materials Science Forum (Volumes 539-543)

Pages:

2651-2656

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.539-543.2651

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Online since:

March 2007

Authors:

C.J. Huang, E. Ghassemieh

Keywords:

Finite Element Thermocoupled Analysis, Material Softening, Ultrasonic Consolidation

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