Preparation of Green Tapes for LTCC/Cu Multilayer Substrates

Yan Wang; Yang Liu; Ju Sheng Ma

doi:10.4028/www.scientific.net/MSF.546-549.2279

Paper Titles

Mechanical Properties and Shape Memory Effects of TiNiNb Shape Memory Alloys with Low Niobium Content
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Micro-Pore Structure and Mechanical Properties of High Temperature Self-Lubricating Biomimetic TiC/FeCrWMoV Cermets
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Preparation of Green Tapes for LTCC/Cu Multilayer Substrates
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Fabrication of Mo/Cu Functional Graded Material by Resistance Sintering under Ultra-High Pressure
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Effect of Tin Additive on the Microstructure and Loss of Ferrite for Switching Mode Power Supply
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Preparation of Green Tapes for LTCC/Cu Multilayer Substrates

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Periodical:

Materials Science Forum (Volumes 546-549)

Pages:

2279-2282

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.546-549.2279

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Online since:

May 2007

Authors:

Yan Wang, Yang Liu, Ju Sheng Ma

Keywords:

LTCC/Cu, Poly(methyl methacrylate) (PMMA), Substrate, Tape Casting

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References

[1] Yan Wang, Yang Liu and Jusheng Ma: Mater. Sci. Forum Vols. 475-479 (2004), p.1763

Google Scholar

[2] Yonggang Wang, Guangneng Zhang and Jusheng Ma: Mater. Sci. Eng. Vol. B94( 2002), p.48

Google Scholar

[3] Raj N. Master, L. Wynn Herron and Rao R. Tummala: IEEE Trans. Components, Hybrids, Manuf, Tech. Vol. 14(4)(1991) p.780

Google Scholar

[4] Sang-Jin Lee, Waltraud M. Kriven: J. Mater. Res. Vol.12(9)(1997), p.2411

Google Scholar

[5] T. Nishimura and S. Yuhaku, in: Advances in ceramics, edited by M. F. Yan and K. Niwa, Vol. 26(1989), p.467

Google Scholar

[6] Loey A. Salam, Richard D. Matthews and Hugh Robertson: J. Eur. Ceram. Soc. Vol. 20(2000), p.335

Google Scholar

[7] Loey A. Salam, Richard D. Matthews and Hugh Robertson: J. Eur. Ceram. Soc. Vol20 (2000), p.1375

Google Scholar

[8] Qingxue Zhang, Xiaojun Luo et al. J. Mater. Sci. Vol. 38(2003), p.1781

Google Scholar

[9] Kevin G. Ewsuk, in: in Ceramic Transactions, Vol.15(1989), p.279

Google Scholar