Stability of the Two Way Memory Effect during Thermal Cycling of a High MS Temperature Cu-Al-Ni Alloy

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Periodical:

Materials Science Forum (Volumes 56-58)

Edited by:

B.C. Muddle

Pages:

541-546

DOI:

10.4028/www.scientific.net/MSF.56-58.541

Citation:

P. Rodriguez and G. Guénin, "Stability of the Two Way Memory Effect during Thermal Cycling of a High MS Temperature Cu-Al-Ni Alloy ", Materials Science Forum, Vols. 56-58, pp. 541-546, 1990

Online since:

January 1991

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$35.00

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