Semi-Enclosed Cold Forging Process Analysis and Progressive Die Design of CPU Fin

Abstract:

Article Preview

This paper analyzes the forming process methods of fin used in CPU chip to emit heat. The whole process is blanking, the first forging forming, the second forging (sizing), and trimming. The chamfer design of CPU fin blank is simulated by finite element analysis. The optimized chamfer 1.6 mm is available. Semi-enclosed cold forging of progressive dies is put forward. The newly designed transfer unit is applied, which unifies the merit of high efficiency of the progressive dies and the high material-using ratio of the project die. Quick disassembly structure is designed and pins are used as quick disassembly pins by means of ball bearing bushing. The unique processing of the shearing scrap structure is adopted when designing the inverted trimming dies. Compared with the traditional die, the mechanization and electrization are realized to increase the production efficiency and get highly precise CPU fin.

Info:

Periodical:

Materials Science Forum (Volumes 575-578)

Edited by:

Jitai NIU, Zuyan LIU, Cheng JIN and Guangtao Zhou

Pages:

174-179

DOI:

10.4028/www.scientific.net/MSF.575-578.174

Citation:

J. H. Su et al., "Semi-Enclosed Cold Forging Process Analysis and Progressive Die Design of CPU Fin", Materials Science Forum, Vols. 575-578, pp. 174-179, 2008

Online since:

April 2008

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.