Influence of Delamination of Epoxy/Dielectric Interfaces on Pattern Shift and Passivation Cracking under Aeronautical Conditions

Yu Ting He; Hong Peng Li; Rong Hong Cui; Chao Hua Fan

doi:10.4028/www.scientific.net/MSF.575-578.919

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Structure Optimization in the Stacked Package of IC Microstructures
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Numerical Modeling of the Electrical Resistivity of Carbon Black Filled Rubber
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Numerical Simulation of Thermal Stress Fields during Gas Quenching
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Influence of Delamination of Epoxy/Dielectric Interfaces on Pattern Shift and Passivation Cracking under Aeronautical Conditions

Abstract:

Interfacial delamination is a recognized failure mode in Integrated circuits (ICs). A major cause for this failure is the mismatch of Thermal Expansion Coefficients, Young’s modulus, and Poisson’s ratios of the package materials. Here, the influence of delamination between epoxy and dielectric layers on pattern shift and passivation cracking in IC package under aeronautical conditions, mainly temperature and load cycles, is studied by maximum plastic strain and maximum principal stresses theory using a certain 2D FEM model with different delamination length “L_c.right”. Delaminations are easy to introduce more dangerous impact to the package, because the IC microstructures endure serious thermo-mechanical loading under aeronautical working conditions. The method can be used to find the dangerous designed structure schedules and will provide a basis for selecting passivation materials of aeronautical IC packages.