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HomeMaterials Science ForumMaterials Science Forum Vols. 575-578Finite-Element Analysis of Thermal Stresses in...

Finite-Element Analysis of Thermal Stresses in Diamond Film Deposition on Mo Substrate with Ti Interlayer

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Physical and Numerical Simulation of Materials Processing

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Periodical:

Materials Science Forum (Volumes 575-578)

Pages:

996-1001

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.575-578.996

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Online since:

April 2008

Authors:

Zheng Liu, Cheng Ming Li, De Cao Niu, Hao Lan, Wei Zhong Tang, Guang Chao Chen, Jian Hua Song, Yu Mei Tong, Fan Xiu Lu

Keywords:

Finite Element, Free-Standing Diamond Film, Thermal Stress, Titanium Interlayer

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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