Finite-Element Analysis of Thermal Stresses in Diamond Film Deposition on Mo Substrate with Ti Interlayer

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Periodical:

Materials Science Forum (Volumes 575-578)

Edited by:

Jitai NIU, Zuyan LIU, Cheng JIN and Guangtao Zhou

Pages:

996-1001

DOI:

10.4028/www.scientific.net/MSF.575-578.996

Citation:

Z. Liu et al., "Finite-Element Analysis of Thermal Stresses in Diamond Film Deposition on Mo Substrate with Ti Interlayer", Materials Science Forum, Vols. 575-578, pp. 996-1001, 2008

Online since:

April 2008

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$35.00

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