Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method

Abstract:

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In this paper, the characteristics of bond interface and bonding mechanism were investigated with peeling-off method. The fracture was observed and interfacial composition was certified by map scanning of EDX (Energy dispersive X-ray analysis). Based on the features of interfacial characters, the actual joining area mainly distributed at bond periphery; non-bonded at bond center. When the bonding time was lower, the ratio of the bond length to its width was larger and elemental aluminum distributed discontinuously on the bond fracture, primarily at the periphery. After aging, the fractures were also analyzed and Cu2Al3 intermetallic compound (IMC) was identified. The phenomena of bond interfacial tracings were analyzed, and the bonding mechanism was ascribed to plastic flow analyzed by finite element method based on the contact issues.

Info:

Periodical:

Materials Science Forum (Volumes 580-582)

Edited by:

Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na

Pages:

173-176

DOI:

10.4028/www.scientific.net/MSF.580-582.173

Citation:

H. S. Bang et al., "Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method", Materials Science Forum, Vols. 580-582, pp. 173-176, 2008

Online since:

June 2008

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Price:

$35.00

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