Thermal, Mechanical and Electrical Properties of High Density Polyethylene Composites Reinforced with Copper Powder

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Abstract:

The thermal conductivity, electrical conductivity and mechanical properties such as tensile strength, elongation, modulus of elasticity, were experimentally investigated. Thermal and electrical conductivity measurements were performed up to filler concentration of 30 vol.%. The mechanical properties of high density polyethylene filled with up to 30 vol.% Cu particles were investigated. The tensile strength, elongation and toughness decreased with increasing Cu powder content. This was attributed to the introduction of discontinuities in the polymer structure in which modulus of elasticity increased with increasing the copper content.

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191-194

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January 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] Zhu, K., Schmauder, S., Comput. Mater. Sci., Vol. 28 (2003), p.743.

Google Scholar

[2] Rusu, M., Sofian, N., Rusu, D., Poly. Testing, Vol. 20 (2001), p.409.

Google Scholar

[3] Tavman, I., H., Powder Techn., Vol. 91 (1997), p.63.

Google Scholar

[4] Tavman, I., H., App. Poly. Sci., Vol. 62 (1996), p.2161.

Google Scholar

[5] Manunya, Y.P., Davydenko, V.V., Pissis, P., Lebedev, E.V., European Poly. J., Vol. 38 (2002), p.1887.

Google Scholar

[6] Bigg, D., B., Advanced Polymer Science, Vol. 1 (1995), p.119.

Google Scholar

[7] Krupa, I., Chodack, I., European Poly. J., Vol. 37 (2001), p.2159.

Google Scholar

[8] Yu, DM., Wu, Composite Sci. Techn., Vol. 60 (2000), p.499.

Google Scholar

[9] Agari Y, Uno T. J. App. Poly. Comp. Sci., Vol. 32 (1986) pp.5705-5712.

Google Scholar