Microstructure and Thermo-Physical Properties of TiB₂/Si-30Al Composite for Electronic Packaging Applications

Abstract:

2wt.%TiB₂/Si-30Al composite was prepared by in-situ reaction and spray forming first and then by hot isostatic pressing (HIP). The microstructure and thermo-physical properties of the composite were investigated by means of scanning electron microscopy, and thermal expansion analyzer respectively. The results show that the microstructure of the TiB₂/Si-30Al composite consists of a continuous network of primary Si (~35μm), interpenetrating secondary Al phase, and fine TiB₂ particles (1~2μm). The TiB₂ particles were uniformly distributed in the Si-30Al alloy matrix. After HIP, the pores in the TiB₂/Si-30Al composite were almost eliminated, and the relative density of the composite was up to 98.9%. The 2wt.%TiB₂/Si-30Al composite after the HIP exhibits good thermo-physical properties, including lower coefficient of thermal expansion (CTE) (6.6´10^-6×K^-1) and higher thermal conductivity (84 W×m^-1×K^-1).

• Periodical: Materials Science Forum (Volume 687)
• Pages: 138-143
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.687.138
• Online since: June 2011
• Authors: Gui Sheng Gan, Lei Zhang, Yi Lu, Bin Yang
• Keywords: Electronic Packaging, Spray Forming, TiB₂/Si-30Al Composite

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