Thermal Analysis of Dedicated Computer Based on ANSYS

Abstract:

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After creating the three-dimensional models of dedicated computer, models can be smoothly put into ANSYS through interface between Pro/E and ANSYS. By selecting the grid cells, setting parameters of material properties, dividing grids, applying load and boundary conditions and post-processing, the temperature contours of the whole case and its key components are got. Compared with the test results, it was verified that the feasibility and rationality of carrying out thermal simulation by ANSYS software, providing a theoretical basis for the designers to optimize dedicated computer case.

Info:

Periodical:

Materials Science Forum (Volumes 697-698)

Edited by:

Tian Huang, Dawei Zhang, Bin Lin, Anping Xu, Yanling Tian and Weiguo Gao

Pages:

277-281

DOI:

10.4028/www.scientific.net/MSF.697-698.277

Citation:

Y.R. Zhang et al., "Thermal Analysis of Dedicated Computer Based on ANSYS", Materials Science Forum, Vols. 697-698, pp. 277-281, 2012

Online since:

September 2011

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Price:

$35.00

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