Paper Titles

Effect of AlN on Microstructure and Mechanical Properties of Mg-Al-Zn Alloy
p.1095

Study on Viscosity of Zr-Cu Alloys Based on Viscosity Measurement and Hirai Model
p.1100

Geometric Parameters Optimization Design for Aluminum Alloy Welding Joint Based on Increasing Fatigue Strength
p.1106

Microstructure of Aluminum Bronze Coating Sprayed by Cold Gas Dynamic Spraying (CGDS)
p.1112

Simulation of the Young’s Modulus Anisotropy in CVD Diamond Film
p.1117

Effect of Bell-Type Annealing Process on Properties of SPCC Cold-Rolled Steel Sheet
p.1123

Thermal Simulation Study of 900MPa Grade High-Strength Low Alloy Steel in Welding Procedures
p.1128

Surface Finishing for Al₂O₃ Ceramics
p.1133

Modeling of Carburization and Thermal Stress Analysis for Ethylene Cracking Furnace Tube
p.1136

HomeMaterials Science ForumMaterials Science Forum Vols. 704-705Simulation of the Young’s Modulus Anisotropy in...

Simulation of the Young’s Modulus Anisotropy in CVD Diamond Film

Article Preview

Abstract:

The relationship between textures and Young’s modulus in CVD diamond films was simulated based on the phenomenological theory, which indicates the textures induce the Young’s modulus anisotropy. The increase of methane concentration changes the density of different fiber textures in diamond films, which induces the increase of Young’s modulus in the directions that parallel to the film surface. Among the textures, {111} texture is of no influence whereas {011} texture has the maximum influence on the Young’s modulus anisotropy of diamond film.

You might also be interested in these eBooks

Physical and Numerical Simulation of Material Processing VI

Info:

Periodical:

Materials Science Forum (Volumes 704-705)

Pages:

1117-1122

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.704-705.1117

Citation:

Cite this paper

Online since:

December 2011

Authors:

H.X. Zhu, C. Gu, Y.D. Xue, Feng Zhang Ren

Keywords:

Anisotropy, CVD, Diamond Film, Texture, Young's Modulus

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] G. X. Ma, G. P. Xing and S. B. Qiu: Vacuum Electronics Vol. 5 (2009), p.5.

[2] M. Hiramatsu, C. H. Lau. Bennett: Thin Solid Films Vol. 407 (2002), p.18.

[3] Y. L. Liu, F. J. Kong and B. W. Yang: Acta Physica Sinica Vol. 56(2007), p.5413.

[4] F. X. Lü, W. Z. Tang and T. B. Huang: Dia. & Relat. Mater Vol. 10 (2001), p.1551.

[5] N. Savvides, T. J. Bell: Thin Solid Films Vol. 228 (1993), p.289.

[6] C. C. Chin, Y. Liou and Y. D. Juang: Thin Solid Films Vol. 260 (1995), p.118.

[7] W. M. Mao, H. X. Zhu and L. Chen: Mater. Sci. & Tec Vol. 21 (2005), p.1383.

[8] T. Anthony: Dia. & Relat. Mater Vol. 4 (1995), p.1346.

[9] D. Schneider, B. Schultrich and P. Burck: Dia. & Relat. Mater Vol. 7 (1998), p.589.

[10] P. Hollman, A. Alahelisten and M. Olsson: Thin Solid Films Vol. 270 (1996), p.137.

[11] J. Hirsch, K. Lücke: Acta metall Vol. 36 (1998), p.2863.

[12] N. Shang, C. Lee: Dia. & Relat. Mater Vol. 9 (2000), p.1388.

[13] O. Durand, R. Bisaro and C. J. Brierley: Mater. Sci. & Engin Vol. A288 (2000), p.217.

[14] H. Windischman, F. Glenn: J. Appl. Phys Vol. 69 (1991), p.2231.

[15] G. H. Zhu, W. M. Mao and Y. Y. Yu: Scripta Mater Vol. 42 (2000), p.37.

[16] S. K. Choi, D. Y. Jung: J. Vac. Sci. Tech Vol. 14(1996), p.165.

[17] T. K. Cheng, R. L. Chii: Thin Solid Films Vol. 290(1996), p.254.

[18] L. Bergman, R. J. Nemanich: J. Appl. Phys Vol. 78 (1995), p.6709.