High Temperature Deformation Behavior and Microstructure Preparation of Cu-Ni-Si-P Alloy

Abstract:

The hot deformation behavior of Cu-Ni-Si-P alloy have been investigated by means of isothermal compression tests on a Gleeble-1500D thermal mechanical simulator in the temperature ranges of 873-1073 K and strain rate ranges of 0.01-5s^-1. The results show that the dynamic recryatallization occurs in Cu-Ni-Si-P alloy during hot deformation. The peak stress during hot deformation can be described by the hyperbolic sine function. The influence of deformation temperature and strain rate on the peak stress can be represented using the Zener-Hollomon parameter. Moreover, the activation energy for hot deformation of Cu-Ni-Si-P alloy is determined to be 485.6 kJ / mol within the investigated ranges of deformation temperature and strain rate. The constitutive equation of the Cu-Ni-Si-P alloy is also established. Keywords: Cu-Ni-Si-P alloy; Hot deformation; Dynamic recrystallization; Zener-Hollomon parameter.

• Periodical: Materials Science Forum (Volumes 704-705)
• Pages: 135-140
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.704-705.135
• Online since: December 2011
• Authors: Yi Zhang, Bao Hong Tian, Ping Liu
• Keywords: Cu-Ni-Si-P Alloy, Dynamic Recrystallization (DRX), Hot Deformation, Zener-Hollomon Parameter

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