Evaluation of the Current Modulation Effect on the Cathodic Efficacy during Copper Electroplating in Alkaline Medium

Article Preview

Abstract:

The main aim of this paper is to study copper ions electroplating, evaluating the cathodic current efficacy, from cyanide ion free alkaline baths, stabilized by different complexant agents for the Cu2+ ions. The cathodic current efficacy was assessed through quartz microbalance measurements, employing different current modulations. Results revealed that the pulsed current application has great influence on the cathodic current efficacy during electroplating in the baths under study.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

172-177

Citation:

Online since:

September 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2015 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] M. Schlesinger and M. Pauvonic: Modern Electroplating. (John Wiley & Sons 4a. ed. New York, 2000).

Google Scholar

[2] E. Budevski, G. Staikov and W. J. Lorenz: Electrochemical Phase Formation and Growth - An Introduction to the Initial Stages of Metal Deposition. (Wiley-VCH, Weinheim-D, 1996).

DOI: 10.1002/9783527614936

Google Scholar

[3] L.G. Durney: Electroplating Engeneerig Handbook 4th edition, (1984).

Google Scholar

[4] J. Crousier and I. Bimaghra: Electrochim. Acta Vol. 34 (1989), p.1205.

Google Scholar

[5] M.J. Armostrong and R.H.J. Muller: Electrochem. Soc. Vol. 138 (1991), p.2303.

Google Scholar

[6] I.A. Carlos, AM.R.H. Almeida I.A. Carlos, L.L. Barbosa C.A.S. Caldas, E.M.J.A. Pallone: J. Appl. Electrochem. Vol. 32 (2002), p.763.

Google Scholar

[7] I. A Carlos, L. L Barbosa, M. Yonashiro, R.M. Carlos, G.M. Oliveira and M.R.H. Almeida: Surf. Coat. Tech. Vol. 192 (2005), p.145.

Google Scholar

[8] I.A.J. Carlos: Appl. Electrochem Vol. 30 (2000), p.987.

Google Scholar

[9] I.A.; Carlos, C.A. S Caldas, E.M.A.L. Pallone and E.D. Bidoia: Surf. Coat. Tech. Vol. 157 (2002), p.14.

Google Scholar

[10] S. Mohan and V. Raj: Trans. of the Institute of Metal Finishing Vol. 834 (2005), p.194.

Google Scholar

[11] M.A. Pasquale, L.M. Gassa and A.J. Arvia: Electrochimica Acta Vol. 53 (2008), p.5891.

Google Scholar

[12] J.J. Kelly and A.C.J. West: Electrochem. Soc. Vol. 145 (1998), p.3472.

Google Scholar

[13] D.A. Buttry: Electroanal. Chem. Vol. 17 (1991), p.1.

Google Scholar

[14] S.J. Martin, J.J. Spates, K.O. Wessendorf and T.W. Schneider: Anal. Chem. Vol. 69 (1997), p.11.

Google Scholar

[15] M.T. Cunha, J. Johann, P.L.G.C.; Furumura and P.R.P.; Rodrigues: Rev. Virtual Quim. 2012, [in press].

Google Scholar