Low Temperature Effect in Electrical Properties of Sintered Copper-Nickel-Aluminum Alloys

Abstract:

The major effort of sintered metallic alloys (compression, homogenization and sintering of metallic powder) is the observation of the evolution of electrical conductivity, mechanical properties (microhardness tests) and microstructures changes after appropriate thermomechanical treatments with the use of copper-nickel-aluminum alloys as electric material. In this case, the purpose was to verify the possible changes in these materials when subjected at low temperatures. Samples of Cu_x%Ni_y%Al_z% initially compressed, sintered and homogenized were characterized by optical metallography (microstructure) and mechanical strength (hardness Vickers) at room temperature. Data of x-ray diffraction of polycrystalline samples were collected with a conventional Difractometer. After this was made measurements of electrical properties (electrical conductivity) at low temperatures of samples obtained from precursors of high purity in powder form, for the study of the influence of powder metallurgy processes in physical properties of metallic alloys in this condition.

• Periodical: Materials Science Forum (Volume 805)
• Pages: 694-699
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.805.694
• Online since: September 2014
• Authors: Waldemar Alfredo Monteiro*, Juan Alfredo Guevara Carrió, Claudia R. da Silveira, Marcelo Carvalhal, Terezinha J. Masson
• Keywords: Copper-Nickel-Aluminum Alloys, Electrical Properties at Low Temperatures, Mechanical Property, Microstructure, Powder metallurgy, Structural Characterization

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