Electron Microscopic Study of Nodules Formed during Electrodeposition of Copper on Aluminium

Arun Augustin; K. Udaya Bhat; K. Rajendra Udupa; Ampar Chitharanjan Hegde

doi:10.4028/www.scientific.net/MSF.830-831.371

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HomeMaterials Science ForumMaterials Science Forum Vols. 830-831Electron Microscopic Study of Nodules Formed...

Electron Microscopic Study of Nodules Formed during Electrodeposition of Copper on Aluminium

Abstract:

Copper thin film was deposited on double zincated aluminium using electrodeposition route. To understand the growth behavior of copper nodules, deposition was done by varying coating current density. The topography and cross section of the coating was analyzed by using SEM. The structural details of copper nodules were studied by using TEM. Deposited copper thin film was made up of pomegranate like nodules with size varying from 5 μm to 8 μm, varying as a function of coating current density. At higher current density, the coating was made up of multiple layers of nodules having defects like twins, dislocations and stacking faults. The nodules had fine crystallites of size in the range of 50 nm.

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Periodical:

Materials Science Forum (Volumes 830-831)

Pages:

371-374

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.830-831.371

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Online since:

September 2015

Authors:

Arun Augustin, K. Udaya Bhat*, K. Rajendra Udupa, Ampar Chitharanjan Hegde

Keywords:

Antimicrobial Touch Surface, Copper Electrodeposition, Nanocrystallites, Twins

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