Characterization of Different Adhesives for Bonding Thermal Protection System (TPS) on a Space Crew Capsule

Digendranath Swain; S. Karthigai Selvan; G. Rajesh Kumar; J.O. Abhilas; Binu P. Thomas; Jeby Philip

doi:10.4028/www.scientific.net/MSF.830-831.407

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HomeMaterials Science ForumMaterials Science Forum Vols. 830-831Characterization of Different Adhesives for...

Characterization of Different Adhesives for Bonding Thermal Protection System (TPS) on a Space Crew Capsule

Abstract:

This paper demonstrates a unique application of DIC wherein the structural performance and structural integrity have been evaluated together almost in real-time. The results obtained from the ground level tests, simulating the bonding between the TPS to the base structure of a space crew module, are reported to find the adequacy of two different adhesives prior to actual bonding. The test objective was to characterize the adhesives based on the structural performance (deflection and strain behavior) of the TPS and conduct health monitoring in real-time (i.e. abort the test whenever the TPS fails). The dual objective could be met using DIC in a full-field and non-contact manner, which was essential due to the limitations of the contacting type measurements.

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Periodical:

Materials Science Forum (Volumes 830-831)

Pages:

407-410

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.830-831.407

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Online since:

September 2015

Authors:

Digendranath Swain*, S. Karthigai Selvan, G. Rajesh Kumar, J.O. Abhilas, Binu P. Thomas, Jeby Philip

Keywords:

Adhesive Bonding, Digital Image Correlation (DIC), Non-Destructive Evaluation (NDE), Structural Integrity, Structural Performance, Thermal Protection System (TPS)

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References

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[2] D. Swain, J. Philip, S.A. Pillai, Optimized Digital Image Correlation (DIC) for measuring large strain gradient regions, Indian Conference on Applied Mechanics (INCAM) 2013, IIT Madras.

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[3] H.W. Schrier, J.J. Orteu, M.A. Sutton, Image Correlation for shape, motion and deformation measurement, Springer, (2009).

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