Laser-Assisted Waterjet Micro-Grooving of Silicon Wafers for Minimizing Heat Affected Zone

Xiang Ning Pan; Chuan Zhen Huang; Jun Wang; Hong Tao Zhu; Peng Yao

doi:10.4028/www.scientific.net/MSF.861.133

Paper Titles

Study on the Simplification of Spiral Bevel Gear Grinding Model
p.108

Surface Morphology of Silicon Induced by Laser Ablation in Flowing Water
p.115

The Effects of Ultrasonic Vibration in Hot Pressing for Microgrooves
p.121

The Surface Topography in Machining of Medical Metallic Materials: A Review
p.127

Laser-Assisted Waterjet Micro-Grooving of Silicon Wafers for Minimizing Heat Affected Zone
p.133

Experimental Study of Laser Welding Process and Properties of 2205 Duplex Stainless Sheet Steels
p.141

High Strength Titanium Rods Produced by Thermomechanical Powder Consolidation
p.147

Low-Cost α+β PM Ti Alloys by Fe/Ni Addition to Pure Ti
p.153

Material Performance in Laser Cladding of a Laminated Plate with Wavy Bond Interface
p.159

HomeMaterials Science ForumMaterials Science Forum Vol. 861Laser-Assisted Waterjet Micro-Grooving of Silicon...

Laser-Assisted Waterjet Micro-Grooving of Silicon Wafers for Minimizing Heat Affected Zone

Abstract:

Laser-assisted waterjet micro-machining can significantly reduce the thermal damages to the workpiece as compared to the traditional laser machining process, and hence can overcome the problems associated with laser machining, such as the formation of heat-affected zone, which is a serious issue for thermal sensitive and functional materials. An experimental study on micro-grooving of monocrystalline silicon wafers is reported in this study to explore the effects of process parameters on the groove depth and width as well as the heat-affected zone (HAZ) width. Predictive models based on dimensionl analysis are then developed for estiamting the groove characteristics.

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Periodical:

Materials Science Forum (Volume 861)

Pages:

133-138

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.861.133

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Online since:

July 2016

Authors:

Xiang Ning Pan, Chuan Zhen Huang*, Jun Wang, Hong Tao Zhu, Peng Yao

Keywords:

Heat-Affected Zone, Laser-Assisted Waterjet, Microgrooving, Silicon Wafers

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