Effects of Bismuth Content on the Microstructure, Shear Strength and Thermal Properties of Sn-0.7Cu-0.05Ni Solder Joints

Abstract:

The effects of bismuth content on the microstructure, shear strength and thermal properties of Sn-0.7Cu-0.05Ni solder joints were investigated. Adding 2 wt% elemental Bi to Sn-0.7Cu-0.05Ni solder joints reduced peak temperature by about 6.7 °C, increased pasty range by 4.2 °C and raised undercooling by 3.1 °C. The microstructure of the interfacial layer between solder and Cu substrate was composed of (Cu,Ni)₆Sn₅ and (Cu,Ni)₃Sn intermetallic compounds (IMCs). The solder joint included a phase of SnBi and Cu₆Sn₅ IMCs. The addition of elemental Bi increased shear strength and suppressed the growth of IMCs in the interfacial layer of the solder joints.

• Periodical: Materials Science Forum (Volume 982)
• Pages: 115-120
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.982.115
• Online since: March 2020
• Authors: Phairote Sungkhaphaitoon*, phairote Suwansukho
• Keywords: Intermetallic Compound, Shear Strength, Sn-0.7Cu-0.05Ni Solder Joints, Soldering

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