Synthesis of Cyanate Ester Based Thermoset Resin by Using Copper (II) Oxalate as Catalyst and its Application in Carbon Fiber Composites

Abstract:

Polymer matrix plays a crucial role in the development of advanced light weight composite materials, and is mainly responsible for thermal and mechanical properties. These polymer matrices are usually thermosetting plastics due to their ease of processing. Thermoset resins were prepared using different compositions of dicyanate ester of bisphenol A and polyether imide and carbon fiber laminates were prepared by wet layup technique. Small amount of epoxy (diglycidyl ether of bisphenol A) was also added to the composites to improve the (interfacial) bonding between the carbon fiber and the resin. The Copper (II) oxalate with 1,5-pentanediol was used as a catalyst for the first time to reduce the curing time from eight hours to four hours. The catalyst has also reduced the curing temperature from 400°C to 250°C. The catalyst Copper (II) oxalate is commercially available. The plasticizer has improved the thermal and mechanical properties of the matrix significantly. The addition of epoxy to the thermoset resin improved the (interfacial) bonding between the resin and carbon fiber. FTIR results suggest that the polymerization reaction of dicyanate results in the formation of trizine ring with phenolic group. SEM results show the interaction of bisphenol A dicyanate (BPADCy) monomer to form polymer matrix. SEM images also represent a uniform anchoring of matrix on the individual carbon filament. It is clear from thermal analysis that sample having 85% BPADCy and 15% polyetherimide (BPR-2) shows the greater thermal stability which is due to the reaction of epoxy with cyanate matrix.

• Periodical: Nano Hybrids and Composites (Volume 22)
• Pages: 1-9
• DOI: https://doi.org/10.4028/www.scientific.net/NHC.22.1
• Online since: September 2018
• Authors: Syed Sajid Ali Shah, Habib Nasir*, Noaman Ul-Haq
• Keywords: Bisphenol A, Carbon Fiber Reinforced Polymer (CFRP), Copper (II) Oxalate, Epoxy, FTIR, SEM, TG/DTA, Thermal Behavior, Thermoset Resin

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