Effect of Characteristics of Nano-Colloidal Silica Abrasives on Wafer Surface Roughness for Wafer Touch Polishing

Abstract:

The purpose of this study is to reveal the mechanism of wafer touch polishing by high purity colloidal silica slurry containing organic surfactants such as HEC (hydroxyl-ethyl cellulose). The effect of surfactant concentration on wafer touch polishing was studied with the aim of improving roughness on wafer surface after polishing. As a result, the level of haze and micro-roughness are decreased with the decrease of surfactant concentration.

• Periodical: Solid State Phenomena (Volumes 121-123)
• Pages: 1229-1232
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.121-123.1229
• Online since: March 2007
• Authors: Jin Hyung Park, Ung Yu Paik, Jea Gun Park
• Keywords: Haze, Non-Ionic Surfactant, Roughness, Slurry, Wafer Polishing

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