Effect of Characteristics of Nano-Colloidal Silica Abrasives on Wafer Surface Roughness for Wafer Touch Polishing

Abstract:

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The purpose of this study is to reveal the mechanism of wafer touch polishing by high purity colloidal silica slurry containing organic surfactants such as HEC (hydroxyl-ethyl cellulose). The effect of surfactant concentration on wafer touch polishing was studied with the aim of improving roughness on wafer surface after polishing. As a result, the level of haze and micro-roughness are decreased with the decrease of surfactant concentration.

Info:

Periodical:

Solid State Phenomena (Volumes 121-123)

Edited by:

Chunli BAI, Sishen XIE, Xing ZHU

Pages:

1229-1232

DOI:

10.4028/www.scientific.net/SSP.121-123.1229

Citation:

J. H. Park et al., "Effect of Characteristics of Nano-Colloidal Silica Abrasives on Wafer Surface Roughness for Wafer Touch Polishing", Solid State Phenomena, Vols. 121-123, pp. 1229-1232, 2007

Online since:

March 2007

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Price:

$35.00

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