Atomic Layer Deposition of Thin Inorganic Coatings onto Renewable Packaging Materials

Abstract:

Biopolymers play still a relatively minor role in the packaging material markets. For this to grow further there are problems to be solved, such as inadequate barrier properties and moisture sensitivity. Atomic layer deposition (ALD) is one potential solution. Atomic layer deposition is a layer-by-layer thin film deposition process based on self-limiting gas-solid reactions. It is well suited for producing pinhole free barrier coatings uniform in thickness at relatively mild process conditions. The purpose of this presentation is to summarize our recent work done concerning atomic layer deposition of thin aluminum oxide layers onto biopolymers.

• Periodical: Solid State Phenomena (Volume 185)
• Pages: 12-14
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.185.12
• Online since: February 2012
• Authors: Mika Vähä-Nissi, Terhi Hirvikorpi, Jenni Sievänen, Katriina Matilainen, Erkki Salo, Ali Harlin
• Keywords: Aluminium Oxide, Atomic Layer Deposition, Barrier, Biopolymer, Packaging Material

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