An Evaluation of Sn-Cu-Ga and Sn-Cu-Ag Solder Alloys for Applications within the Electronics Industry

Georgiana Melcioiu; Viorel Aurel Şerban; Mark Ashworth; Cosmin Codrean; Marin Liţă; Geoffrey D. Wilcox

doi:10.4028/www.scientific.net/SSP.216.91

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HomeSolid State PhenomenaSolid State Phenomena Vol. 216An Evaluation of Sn-Cu-Ga and Sn-Cu-Ag Solder...

An Evaluation of Sn-Cu-Ga and Sn-Cu-Ag Solder Alloys for Applications within the Electronics Industry

Abstract:

Components soldered with Sn-based alloys are susceptible to the growth of whiskers. Tin whiskers have been proven to be responsible for equipment failures in a wide range of industries. In order to reduce defects in electronic components a new solder alloy is proposed based on the Sn-Cu alloys. The Sn-Cu-Ga alloy utilised in this study was fabricated as a ribbons using melt-spinning method. These ribbons were then soldered onto electroplated tin layers. Preliminary characterization of the solder alloy is presented in this paper, including scanning electron microscopy, EDX mapping and X-ray diffraction. Key words: tin whiskers, PCB, printed circuit boards, melt spinning, solder, ribbons

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Periodical:

Solid State Phenomena (Volume 216)

Pages:

91-96

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.216.91

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Online since:

August 2014

Authors:

Georgiana Melcioiu*, Viorel Aurel Şerban, Mark Ashworth, Cosmin Codrean, Marin Liţă, Geoffrey D. Wilcox

Keywords:

Melt Spinning, PCB, Printed Circuit Board (PCB), Ribbons, Solder, Tin Whiskers

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