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The qualitative and quantitative evolution of the crystallographic texture during recrystallization annealing is affected by a number of TMP parameters such as the mechanical parameters pertaining to strain mode and amplitude and the thermal parameters pertaining to annealing time and temperature.
The macroscopic deformation is distributed heterogeneously among the individual grains.
The behavior of each grain is determined by its crystallographic orientation and the activated slip systems.
(a) (b) (c) Copper g-fibre Brass Brass S P Goss H Cube q-fibre 3.2 Deformation texture Since the grain size is controlled by grain refinement in the as-cast ingot [4], the crystallographic texture of this material is almost random.
Materials A and B reveal inhomogeneous microstructures consisting of bands of various grain size.

The position distribution and height distribution of the grains/workpiece are generated by random number generator function.
� is the spindle speed, yg is the grain position value in Y coordinate.
�X, �Y, �Z are the grain dynamic displacement in X, Y, Z direction respectively.
Comparing the height of the workpiece–point at the same position (x, y) with the grain height, if the former is higher than the later, the workpiece surface will be removed by the grain.
Rg is the distance between the grain and the wheel center.

A number of stress-strain curves are obtained at 1100°C, the strain rates are shown in Fig. 2.
The most important factor is grain size before deformation.
It has been indicated in another paper [6] that trace RE could significantly refine austenite grain size in this steel, and the grain size is not changed with increasing RE.
Mclean and Northcott [14] have indicated that the driving force, weather the solution elements distribution in the body of grains or at the grain boundaries, is lay on the distortion energy difference.
The literates also have indicated the enrichment of RE at the grain boundaries [16].

The produced SiC shows a high fracture toughness because of the crack propagation along grain boundaries.
The grains larger than Rc grow and the grains smaller than Rc shrink.
The grain size distribution is an important factor controlling the dissolution and precipitation rates.
distance, r R Cr C0 Ci r = 0 r = R Cp Grain distance, r R Cr C0 Ci r = 0 r = R Cp Grain a result, the numbers of grains decrease and a continuous increase in mean grain size occurs.
This result indicates the dissolution of SiC grains into the infiltrated liquid.

A number of workers have attempted to grow high quality GaN films on silicon substrates [2-5].
The grain feature for ITB#161 is roundish in shape judging from the diagonal profile (grain size ~ 0.12µm) and horizontal profile (grain size ~ 0.11µm) (not shown here).
The grain feature for ITB#162 is more oval in shape judging from the diagonal profile (grain size ~ 0.15 µm) and horizontal profile (grain size ~ 0.11 µm).
Furthermore the grain size distribution in this sample is also less homogenous.
This is consistent with our AFM observation that ITB#161 has better surface quality in terms of homogeneity of grain size, grain distribution and surface roughness than ITB#162.

The Ti3SiC2 grains are irregular and small as shown in Fig 3a.
The number and grain size of laminated Ti3SiC2 grains were gradually increased with the sintering temperature (Fig. 3a-e) and holding time (Fig. 3b, f) increasing.
The fracture surface reveals the unique characteristics of Ti3SiC2 materials with many layers, steps and grain buckling.
By these images, different Ti3SiC2 morphologies can also be found, such as grain bending, grain pullout and delaminating.
Besides the laminated Ti3SiC2 grains, some equiaxial grains can be seen in the sample, the equiaxial grains are considered as TiC impurity.

We can see clearly grains shaped in square block polyhedron.
When x=0.00 [fig.1(a)], the ceramic was relatively compact in structure and grain size was relatively uniform.
As x=0.02[fig.1(b)], a homogeneous and dense microstructure was developed, but the number of pores increased.
During the development of the grains, there will be impurity phase.
Variation trend of dielectric constant could be explained by the increased grains size. when x was 0.02, there were many pores among the grains, which influenced the density of the materials.

After 240 hours indentation, there are several grain boundaries appeared changed position around the indentation crater and a few pores formed on the surface of pure tin solder.
Based on the several current studies, the formation of pure tin whisker involved the grain boundary sliding movement which starts with the critical pressure about -15 MPa [15].
According to Horváth et al. [18], the manipulation of the size of the pure tin grain will cause the alteration in the rate of grain boundary diffusion and the level of exerted compressive stress.
Hillock are usually observed when the defect growth is not limited to a single grain, but rather integrates several surrounding grains which may continue to grow alongside over time [21].
Acknowledgement The author gratefully acknowledges the support from the Fundamental Research Grant Scheme (FRGS) under a grant number of FRGS/1/2016/STG07/UNIMAP/02/4 (No: 9003-00600) from the Ministry of Higher Education Malaysia and School of Materials Engineering, Universiti Malaysia Perlis (UniMAP) for supporting the research effort through materials and facilities.

The honing pressure and grain size are the variable parameters in the experiment.
The larger the grain size is, the smaller the mesh size is.
The wear off of old grains and appearance of new grains came into a dynamic balance in honing process.
There is no linear relationship between grain size and the cutting property.
Acknowledgement This work is supported by National Science Foundation of China (NSFC, Grant number 50975198).

In particular, it can lead to grain refinement.
We see that with increasing rolling asymmetry, the grain area is decreasing.
Influence of rolling asymmetry (A=1, A=1.3 and A=1.5) on: a) average grain area (µm2), b) average grain orientation spread and c) Kernel average misorientation.
Influence of rolling asymmetry (A=1, A=1.3 and A=1.5) on grain area (µm2).
Acknowledgements This study was financed by the Polish National Centre for Science (NCN) under decision numbers DEC-2011/01/B/ST8/07394 and DEC-2011/01/D/ST8/07399.