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Online since: October 2011
Authors: Xing Wu Qiu, Yun Peng Zhang, Chun Ge Liu
Introduction Laser surface modification technologies more and more attract people’s attention due to its many advantages such as fast heating, fast cooling, small heat affected zone, can gain fine grain, environmental protection and efficiency.
Figure 2 for the SEM morphology of laser transformation hardening layer, we can see, after laser transformation hardening, the microstructure has become fine and uniform, from the Hall - Page formula: ss=so+kd-1/2, we can see that fine grains of the material not only improves the ductility and toughness, but also increase the strength of the material.
The reasons for this phenomenon are: laser transformation hardening is a rapid heating and cooling process, making the grains in the process of rapid cooling time to grow up to form small martensite.
The wear scar of 45 steel substrates wide and deep, showing a clear plow characteristic, and transfer of a large number of metal spalling, indicating its poor wear resistance.
This is because the wear debris in the process of the shearing strength of the role of relative movement along the surface friction, the friction surface being cut, plow or cutting, thus forming a number of grooves.
Online since: September 2013
Authors: Yu Fang Yang, Jing Yao Zhang
According to the component respectively Numbers for: Fe58Cr12Mo7Y2B6C15-AC1,Fe57Co7Ni10Nb4Y2B15Si5-AC2,Fe55Ni2Cr12Mo10Y2B6C13-AC3,Fe55Nb2Cr12Mo10Y2B6C13-AC4,Fe55Cu2Cr12Mo10Y2B6C13 -AC5.
Table 2 Parameters of arc spraying process Condition Numbers voltage(V) Working distance(mm) Pressure(Mpa) Voltage adjustable 1 2 3 32.5 37.6 41.8 150 0.6 Pressure adjustable 4 5 41.8 100 150 250 0.6 Working distance adjustable 6 7 41.8 150 0.5 0.6 0.7 Experimental Method.
Metallurgical bonding between coating and substrate can be reaction formation intermetallic compound, also can be grain phase contact and presence of grain boundaries in the interface between coating and substrate.
Coating and substrate between has a obvious grain boundaries and mutual can't extension.
Online since: November 2012
Authors: Rui Sun, Cheng Cheng Li, Wei Ming Wang, Yu Run Li
(3) (4) Where DH is the amount of lateral spread predicted (m), M is the moment magnitude of earthquake anticipated, R is the horizontal distance to the fault (km), W is the ratio (%), S is the ground slope (%), T15 is the thickness (m) of the spreadable layer with (N1)60 less than 15, F15 is the average fines content (%) of the spreadable layer, D5015 is the mean grain size (D50) in the layer.
Table 2 Calculation results for lateral spread Born number Magnitude Epicentre (km) Ground ratio (%) Clay contents (%) Mean grain size (mm) Thickness of layers (m) Lateral spreads (m) Lateral spread state 1 7.8 16.6614 1.27 6.71 0.621 2.925 0.106 moderate 2 7.8 19.69175 35.21 19.82 0.246 3.075 0.543 severe 6 7.8 15.7613 28.02 4.4 0.256 1.1 0.675 severe 7 7.8 14.90725 29.28 1.2 0.318 0.8 0.607 severe 8 7.8 19.79946 15.11 8.5 0.533 6.075 0.474 severe 10 7.8 17.74568 1.47 14.44 0.270 8 0.236 moderate 11 7.8 15.2601 10.71 2.90 0.197 3.05 0.760 severe 12 7.8 13.51121 1.27 2.41 0.197 8.4 0.414 severe 13 7.8 16.94211 20.9 10.51 0.175 4.85 0.910 severe 14 7.8 10.4236 6.85 0 0.309 2 0.386 severe 15 7.8 12.3238 10.5 0.66 0.552 2.675 0.332 severe 18 7.8 3.170391 3.88 4.40 0.214 1.1 0.093 slight 19 7.8 6.122333 0 3.04 0.274 6.7 0.054 slight 22 7.8 4.658839 0 0 0.945 1.4 0.021 slight 23 7.8 4.653188 0 4.95 0.203 4.9 0.123 moderate 24 7.8 6.539927 5.15 0 0.184 0.85 0.234 moderate 25 7.8 9.991651
The final lateral spreads are calculated by the MLR method, and given the states in Table 1, in which the borns numbered 3, 4, 5, 9, 16, 17, 20, 21, 28, 29, 30 and 36 are intac.
According to the thickness, silt content and mean grain-size of the liquefied layer, the horizontal distance to the fault and the ground slope for each born hole, the lateral spread displacement states map based on MAPGIS is completed.
Online since: July 2014
Authors: Lian Zhong Liu, Yi Fei Yuan, Chun Yan Han
To strengthen the authentication in BYOD scenario, we propose a security compliance based mobile user authentication scheme, which includes a novel calculation method for device identifier, and a fine-grained compliance strategy and its management.
OPTION=TEL, JMUN,BIO,TOKEN, the elements in set refer to employee’s telephone number, job number, biological features and hardware token respectively.
I Identifiers of mobile devices Identifier Meaning Usage Storage Location Length IMSI International Mobile Subscriber Identification Number Identifier for mobile device subscriber SIM card 15-digit IMEI International Mobile Equipment Identification Number Identifier for mobile device GSM&WCDMA network device 15-digit ESN Electronic Serial Numbers Identifier for mobile device CDMA network device 8-digit MEID Mobile Equipment ID Strengthened ESN CDMA network device 15-digit MAC address Media Access Control Network device identifier NIC 48bit From table 1 we can see that different devices use different identifiers.
Also RULE1 requires user password length should between 10 and 16 characters and the password should include both characters and numbers, and total trial time should less than 4 times, and password is valid.
Secondly, we support a fine-grained compliance strategy for enterprises to strengthen the security of their authentication procedure.
Online since: June 2010
Authors: Wei Xu, Li Fen Hao, Qiu Feng An, Lei Zhou
Methods (1)Experimental enzyme-based integrated processing and conventional processing technology Wet-salted goatskins were cut into two halves, numbered, and soaked conventionally.
(3) Physical testing and hand evaluation of crust leathers.Physical properties such as tensile strength, percent elongation at break, tear strength, and grain crack strength were examined using standard procedures [10].
Experimental and control crust leathers were assessed for softness, fullness, grain smoothness, grain tightness and general appearance by hand and visual examination.
It is seen that hair pores of both samples are visible and clear, there is no grain damage due to usage of enzyme, moreover, experimental sample shows separation of fiber bundles comparable to that of control sample.
Acknowledgements The authors thank Natural Science Foundation of Shaanxi University of Science and Tchnology for finance supports (contract grant number: ZX08-05) and Dr.
Online since: March 2009
Authors: Terlize Cristina Niemeyer, Luciano Henrique de Almeida, Carlos Roberto Grandini, Renata Abdallah Nogueira
A large number of investigations have been carried out in the past 50 years for several bcc pure metals and alloys in order to clarify the nature of the complex interaction among interstitial solutes and the alloy components [7-13].
The microstructure consists of relatively larges grains of the β phase, and the brightness of the areas close to the grain boundaries means higher concentration of heavier elements, which are Nb and Ta, the β stabilizers.
It confirms the absence of α in the grain boundary region.
Fig. 2 - SEM micrograph of the TNZT#1 sample, where the grain boundaries are brighter and thus present higher concentration of the heavier β stabilizers.
The TNZT alloys studied here are polycrystalline with small grains and contain a large number of grain boundaries, which can form trapping sites for oxygen and nitrogen atoms and, as a consequence, increase the diffusion coefficient.
Online since: June 2004
Authors: V.D. Heydemann, David Snyder, W.J. Everson, Marek Skowronski, Rick D. Gamble
The addition of nano-size diamond abrasive (0.1µm grain size) to the CS slurry resulted in a MRR of 0.60µm/h, a 10x increase over CS CMP, and produced substrates with a Ra surface roughness of 5.5Å.
Table 3 displays the Knoop hardness of alternative abrasives that are commercially available in the desired grain size range close to that of CS (0.06µm).
Table 4 displays the Ra roughness average before and after polishing experiments of on-axis SI 6H SiC substrates utilizing a colloidal silica (CS) slurry with the addition of oxide abrasives (aluminum oxide with 1µm and 0.1µm average grain size, zirconium oxide with 2µm average grain size).
The nano-size diamond slurries were added to the CS slurry, starting with 0.05µm grain size due to the close match with the 0.06µm CS grain size.
The work presented is funded by DARPA/MTO, contract number DAAD19-02-1-0231.
Online since: March 2007
Authors: Heung Ju Kim, Hyeon Jin Cho, Chang Keun Chun, Woong Seong Chang
The microstructures of welds, corresponding to the pin hole, have dynamic-recrystallized grain similar to stir zone in FSW weld.
In addition, When applied to aluminum alloys, RSW required much electric power and numbers of electrodes to be renewed in short term.[1-2] Friction spot joining (FSJ) looks like minimize these problems.
TMAZ is characterized by a rotation of the elongated grains of the base metal.
In the heat affected zone, the grain was coarse about 28µm in AA5052 and 29µm in AA6111.
It looks like depend on that grain size is finer grains than that of the base metal.
Online since: April 2020
Authors: Nguyen Duc Thang, Bui Sy Hoang, Le Thi Nhung, Pham Mai Khanh
At the grain boundaries can be found chromium carbides [1,2].
The grain – refining Pearlite colonies were formed in the HAZ.
The abnormal grain growth of some grains can be explained by the simultaneous carbides dissolution and grain boundaries migration at high temperature.
Carbides and delta Ferrite phases can be observed in the grain boundary in the HAZ.
However, the hardness values after PWHT at 600°C are much higher than the number in as-welded condition.
Online since: June 2014
Authors: Akira Sato, Kosuke Omote, Hiroyuki Sato
Based on the concept of the SATO-index, the entire creep curve can be represented by a small number of numerical parameters, and can be extrapolated from a part of the creep curve.
The important parameters are its stress dependence, grain size dependence and temperature dependence.
The values T and are the absolute temperature and the applied stress which determine the creep conditions, and d is the grain size.
Creep behavior is represented by the stress exponent, n, the grain size exponent, p, and the activation energy of creep, Qc.
The grain size is about 0.2mm.
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