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Online since: September 2013
Authors: Zhe Chen, Dong Chen, Yi Wu, Xian Feng Li, Nai Heng Ma, Hao Wei Wang, Ming Liang Wang
Pai, Journal of Materials Processing Technology 166 (2005) 423-429
%SiC/2024Al composite, Materials Science and Engineering A 527 (2010) 7865-7872
Gupta, Kinetics of Hot Deformation in Mg/Nano-Al2O3 Composite, Journal of Composite Materials 44 (2010) 181-194
Evangelist, Isothermal forging of AA2618 + 20%Al2O3 by means of hot torsion and hot compression tests, Materials Science and Engineering A 387-389 (2004) 857-861
Gu, Recrystallization Kinetics of Cold-rolled Squeeze-cast Al/SiC/15w Composites, Journal of Composite Materials 40 (2006) 1117-1131
Online since: July 2011
Authors: Yi Fan Zhang, Jian Wang
Pakkanen: Journal of Applied Polymer Science Vol. 82 (2001), p.258-262
Pakkanen: Journal of Applied Polymer Science Vol. 91 (2004), p.2942-2948
Pizzi: Journal of Applied Polymer Science Vol. 24 (1979), p.1247–1255
Skarzynski: Journal of Applied Polymer Science Vol. 28 (1983), p.531-542
Kohn: Journal of Applied Polymer Science Vol. 16 (1972), p.1585-1602
Online since: March 2012
Authors: Wolfgang Neumann, Holm Kirmse, Ines Häusler, Corinna Grosse, Peter Moeck, Sergei Rouvimov, Matt Beekman, Ryan Atkins, David C. Johnson, Kerstin Volz
Methods of electron crystallography as tools for materials analysis W.
New methods of electron crystallography, particularly modern methods of electron diffraction have opened new strategies for the structure analysis of nanostructured materials and materials systems.
Meerschaut: Misfit layer compounds (MS)nTS2 (M=Sn, Pb, Bi, rare earth metals; T=Nb, Ta, Ti, V, Cr;1.08Materials Science Forum 100-101 (1992) 101 – 172
[11] S. van Smaalen: Superspace description of incommensurate intergrowth compounds and the application to inorganic misfit layer compounds, Materials Science Forum 100–101 (1992) 173 – 222
Journal of Inorg.
Online since: April 2013
Authors: Jie Liu, Yong Qiang Yang, Qing Hua Lu
Some machines will preset materials to the room, which is called recoating in SLS/SLM machines
Acknowledgements This work was financially supported by the National Natural Science Foundation of China (51275179).
Grijpma: Biomaterials Vol. 31 (2010), p. 6121 [2] N.Mostafa, H.M.Syed,S.Igor, G.Andrew: Tsinghua Science & Technology Vol. 14 (2009), p. 29 [3] Y.Y.Chiu, Y.S.Liao and C.C.Hou: Journal of Materials Processing Technology Vol .140 (2003), p. 179 [4] R.Paul, S.Anand: Journal of Manufacturing Systems Vol. 31 (2012), p. 429 [5] X.B.Su, Y.Q.Yang: Journal of Materials Processing Technology Vol. 212 (2012), p. 2074 [6] W.Lu, F.Lin, J.D.Han,H.B.Qi and N.S.Yan: Tsinghua Science & Technology Vol. 14 (2009), p. 120 [7] B.V.Krishna, A.Bandyopadhyay: Materials & Design Vol. 30 (2009), p. 1490 [8] Y.Q.Yang, D.Wang, X.B.Su and Y.H.Chen: 2010 International Conference on Manufacturing Automation Hong Kong (2010), p. 61 [9] J.Liu, Y.Q.Yang and C.H.Song: Journal of South China University of Technology (Natural Science Edition) Vol. 39 (2011), p. 13 [10] Y.Q.Yang, J.B.Lu, Z.Y.Luo, D.Wang: Rapid Prototyping Journal Vol.18 (2012), p. 482
Online since: April 2011
Authors: Patrice Raynaud, Salah Sahli, Leila Bouledjnib, Azziz Zenasni, Yvan Segui
A new class of low-k materials thin films, deposited from a DiPhenyleMethylSilane (DPMS) vapors was prepared using PECVD technique.
Lin: Materials Science and Engineering C Vol. 27 (2007), p. 1145 [2] V.
Dusane: Materials Letters Vol. 60 (2006), p. 1579 [4] Y.
Mercer: Materials Science and Engineering C Vol. 8-9 (1999), p. 361 [8] V.
Breza: Journal of Molecular Structure Vol.699 (2004), p. 93
Online since: December 2024
Authors: Tian Hong Gu, Shu Wei Jiang, Wen Su
Sample and Tensile Testing Material and Sample Geometry.
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243
Online since: May 2016
Authors: Xin Zhang, Zhi Ping Wang, Jin Ting Ni
The current research on vehicle seat safety mainly focuses on dispersing force on passengers during collision, the influences of applying new materials and molding technologies to seats, as well as saving costs, etc[1-13].
The chosen materials for backrest steel pipe, backrest steel wire, seat locking mechanism, body top-locking mechanism, under- mounting points and center support bracket are respectively Q235B, Q235B, ST12, B210P1, ST12, ST12, while the specifications for the first two materials are 25*1.5 and 5.
Ergonomics-based seat design method for the light truck cab, Journal of Chongqing Institute of Technology: Natural Science [J],2008,22(9):20-24 [5] Xiya Guo, Xiang Meng.
The dynamic strength simulation and analyses of the automotive seat based on ADAMS, Journal of Shanxi University of Science & Technology [J], 2007, 25(2):100-104
Journal of Chongqing Institute of Technology: Natrual Science, 2008,22(9):20-24
Online since: May 2011
Authors: Yan Qin, Jian Li, Liang Zhao
Mechanical Properties of UP Resin from Soybean Oil Jian Li1,a Yan Qin2,b Liang Zhao2,c 1Department of Materials Engineering, Hubei Automotive Industries Institute, Shiyan, 442002; 2School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, 430070; aemail:lijian_0711@qq.com; bemail: qinrock@163.com; cemail: zl1982@yahoo.com Keywords:Unsaturated polyester; soybean oil; monoglyceride; mechanical property Abstract.
In this paper, a kind of unsaturated polyester resin (UPR) was prepared by using renewable soybean oil, glycerol, propylene glycol and anhydride as raw materials.
Introduction With the increasing consumption of un-renewable fossil resources, seeking efficient, cheap and renewable materials to prepare green polymers has become a top priority.
Journal of Applied Polymer Science Vol. 97(2005), p. 825-836
Journal of Applied Polymer Science Vol. 90(2003), p. 197-202.
Online since: August 2022
Authors: Nor Azizah Parmin, Zahraa S. Alshaikhli, Makram A. Fakhri, Sarmad Fawzi Hamza Alhasan, May A. Abduljabbar
A Abduljabar, Some of Electrical and Detection properties of nano silver oxide, IOP Conference Series: Materials Science and Engineering 454(1) 2018 012161. doi:10.1088/1757-899X/454/1/012161 [6] T.C.
Salim, Photo Voltaic Properties of AgO/Si Heterojunction Devic Substrate Conductivity, Materials Science Forum, 1002 (2020) 200-210 [27] M.A.
T.Salim, Synthesis of Cadmium Oxide/Si Heterostructure for Two-Band Sensor Application, Iranian Journal of Science and Technology, Transactions A: Science 43(3) (2019) 1337–1343
Agool, Synthesis of SnO2 nanostructures employing Nd:YAG laser, Applied Physics A: Materials Science and Processing 120(2) (2015) 725-730
Nanoelectronics and Materials 9 (2016) 37-49 [48] M.
Online since: November 2011
Authors: Yan Li Liu, Jian Zhang
"The routes towards a silicon-based laser," Materials Today vol. 8, pp. 18-25, 2005
"Growth and use of metal nanocrystal assemblies on high-density silicon nanowires formed by chemical vapor deposition," Applied Physics a-Materials Science & Processing vol. 82, pp. 659-664, 2006
"Laser ablation behavior of a granulated Si target," Journal of Materials Science Letters vol. 18, pp. 123-125, 1999
"Silicon nanowire networks for the application of field effect phototransistor," Materials Science & Engineering C vol., pp. 1197-1200, 2007
"Dendrite-assisted growth of silicon nanowires in electroless metal deposition," Advanced Functional Materials vol. 13, pp. 127-132, 2003