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Online since: December 2004
Authors: H.Y. Xiang, Yue Xian Zhong
Materials Science Forum Vols. *** (2004) pp.503-507
online at http://scientific.net
2004 Trans Tech Publications, Switzerland
Forming Defects Analysis of Auto-panel Stamped Part with
Experimental Strain Approach
H.Y.
The presence of strain gradients in the material element may also distort the ellipse making it very Advances in Materials Manufacturing Science and Technology 504 difficult to identify the major and minor axes.
The principal values, as obtained from (4),are given by: 2 12 22211 2211 2 22 2 11 ) 2 ( 2 , C CCCC + − ± + =λλ The orientation of the principal axes is determined by: 2211 122 2tan CC C − =θ It follows that the principal logarithmic surface strains are: 11 11 lnλε = and 22 22 lnλε = The third principal logarithmic strain, i.e. the thickness strain, is finished by the incompressibility Fig.3 Photograph of the sink area of the automobile panel Fig.4 Deformed shape with grids Advances in Materials Manufacturing Science and Technology 506 assumption: 0332211 =++ εεε Case Study: Strain Analysis of an Automobile Outer Panel Stamped Part For the automobile outer panel parts stamping process, it is usually only one drawing process, subsequent stages are usually punching, flanging and other auxiliary procedure.
Fig.6 illustrate the sectional strain distribution on two given paths, the major、minor and thickness strains on the whole path are calculated and printed out on coordinate, by analyzing this result , it is easy to conclude that the strain gradient on the sink mark area is larger, means that the defect area subjects Fig.5 Forming Limit Diagram Fig.6 Strain distribution on two section Materials Science Forum Vols. *** 507 to uneven stretching during the stamping process.
The grid method present an effective way to measure and calculate the strain distribution over large surface area, this is especially helpful to assist engineers in optimization stamping process and amending of die for automobile panel manufacturing.
The presence of strain gradients in the material element may also distort the ellipse making it very Advances in Materials Manufacturing Science and Technology 504 difficult to identify the major and minor axes.
The principal values, as obtained from (4),are given by: 2 12 22211 2211 2 22 2 11 ) 2 ( 2 , C CCCC + − ± + =λλ The orientation of the principal axes is determined by: 2211 122 2tan CC C − =θ It follows that the principal logarithmic surface strains are: 11 11 lnλε = and 22 22 lnλε = The third principal logarithmic strain, i.e. the thickness strain, is finished by the incompressibility Fig.3 Photograph of the sink area of the automobile panel Fig.4 Deformed shape with grids Advances in Materials Manufacturing Science and Technology 506 assumption: 0332211 =++ εεε Case Study: Strain Analysis of an Automobile Outer Panel Stamped Part For the automobile outer panel parts stamping process, it is usually only one drawing process, subsequent stages are usually punching, flanging and other auxiliary procedure.
Fig.6 illustrate the sectional strain distribution on two given paths, the major、minor and thickness strains on the whole path are calculated and printed out on coordinate, by analyzing this result , it is easy to conclude that the strain gradient on the sink mark area is larger, means that the defect area subjects Fig.5 Forming Limit Diagram Fig.6 Strain distribution on two section Materials Science Forum Vols. *** 507 to uneven stretching during the stamping process.
The grid method present an effective way to measure and calculate the strain distribution over large surface area, this is especially helpful to assist engineers in optimization stamping process and amending of die for automobile panel manufacturing.
Online since: October 2016
Authors: Antônio Hortêncio Munhoz Jr., Leila Figueiredo de Miranda, Cesar Denuzzo, Gabriel Cavalcante Gomes, Alber Luiz do Nascimento, Maura Vincenza Rossi
Nylon 6.12 belongs to the group of amides and is one of the engineering plastics.
With the advent of nanotechnology, a large quantity of engineering materials displaying special characteristics have been coming up by means of nanocomposites.
Materials science and engineering: an introduction. 3rd ed.
Materials Science Forum, v. 798-799, p. 732-736, 2014
The science and engineering of materials. 4th ed.
With the advent of nanotechnology, a large quantity of engineering materials displaying special characteristics have been coming up by means of nanocomposites.
Materials science and engineering: an introduction. 3rd ed.
Materials Science Forum, v. 798-799, p. 732-736, 2014
The science and engineering of materials. 4th ed.
Online since: October 2007
Authors: Ming Bo Yang, Yan Long Ma, Fu Sheng Pan
Advanced Materials-SAMPE.
Vol.35(2003), p.32 [12] M.Pekguleryuz and A.A Kaya: Advanced Engineering Materials.
No.100(1992), p.353 [19] J.Bai, Y.S.Sun and S.Xun: Materials Science and Engineering A.
Medraj: Science and Technology of Advanced Materials, 2007(in press) [26] Z Zhang, R Trembalay and D Dube: Mater.
Forum.
Vol.35(2003), p.32 [12] M.Pekguleryuz and A.A Kaya: Advanced Engineering Materials.
No.100(1992), p.353 [19] J.Bai, Y.S.Sun and S.Xun: Materials Science and Engineering A.
Medraj: Science and Technology of Advanced Materials, 2007(in press) [26] Z Zhang, R Trembalay and D Dube: Mater.
Forum.
Online since: February 2012
The aim of ICMAM2011 is to provide a platform for researchers, engineers, academicians as well
as industrial professionals from all over the world to present their research results and development
activities in Manufacturing Technology and Processing, Mechatronics and Automation,
Mechatronics and Embedded System Applications and the other related topics.
The goal of ICMAM2011 is also to provide international scientific forums for exchange of new ideas focus on information systems and computational intelligence.
Korsunsky, University of Oxford, England International Program Committee Chairs(Taiwan) Chun-Fei Hsu, Chung Hua University, Taiwan Chih-Min Lin, Yuan Ze University, Taiwan Jen-Yuan (James) Chang, National Tsing Hua University, Taiwan Jeng-Haur Horng, National Formosa University, Taiwan International Program Committee Chairs(Japan) Tomonori Hashiyama, The University of Electro Communications, Japan International Program committee Chairs(India) Karm Veer Arya, ABV-Indian Institute of Information Technology & Management,India International Program Committee Chairs(Hungary) Marta Takacs, Obuda University, Hungary Laszlo Horvath, Obuda University, Hungary Jozsef Tar, Obuda University, Hungary International Program Committee Chairs(New Zealand) Raj Das,Department of Mechanical Engineering and Centre for Advanced Composite Materials University of Auckland,New Zealand Program Committee Zhigang Li,Hong Kong University of Science and Technology,Hong Kong
Pithawalla College of Engineering and Technology, India Ping Zheng,Hong Kong University of Science and Technology,Hong Kong Mohd.
The goal of ICMAM2011 is also to provide international scientific forums for exchange of new ideas focus on information systems and computational intelligence.
Korsunsky, University of Oxford, England International Program Committee Chairs(Taiwan) Chun-Fei Hsu, Chung Hua University, Taiwan Chih-Min Lin, Yuan Ze University, Taiwan Jen-Yuan (James) Chang, National Tsing Hua University, Taiwan Jeng-Haur Horng, National Formosa University, Taiwan International Program Committee Chairs(Japan) Tomonori Hashiyama, The University of Electro Communications, Japan International Program committee Chairs(India) Karm Veer Arya, ABV-Indian Institute of Information Technology & Management,India International Program Committee Chairs(Hungary) Marta Takacs, Obuda University, Hungary Laszlo Horvath, Obuda University, Hungary Jozsef Tar, Obuda University, Hungary International Program Committee Chairs(New Zealand) Raj Das,Department of Mechanical Engineering and Centre for Advanced Composite Materials University of Auckland,New Zealand Program Committee Zhigang Li,Hong Kong University of Science and Technology,Hong Kong
Pithawalla College of Engineering and Technology, India Ping Zheng,Hong Kong University of Science and Technology,Hong Kong Mohd.
Online since: November 2013
Authors: Yoshihisa Sakaida, Shohei Yamashita, Hajime Yoshida, Shigeki Yashiro, Takahisa Shobu
Finite Element Analysis
Gas carburizing and quenching processes were simulated by an elastoplastic finite element analysis (DEFORM-HT3, Yamanaka Engineering Co., Japan).
Forum 614 (2009) 11-20
Forum 652 (2010) 31-36
Manzanka, Advances in X-ray Analysis 52 (2009) 561-568
Forum 681 (2011) 346-351
Forum 614 (2009) 11-20
Forum 652 (2010) 31-36
Manzanka, Advances in X-ray Analysis 52 (2009) 561-568
Forum 681 (2011) 346-351
Online since: June 2018
Authors: Gao Yang Zhao, Ying Min Wang, Kai Li Mao, Bin Li
Zhao1,d
1Department of Materials Science & Engineering, Xi’an University of Technology, Xi’an, China
2The 2nd Research Institute of China Electronics Technology Group Corporation, Taiyuan, China
amaokaili001@aliyun.com, bwymzll@126.com, ccetclb@163.com, dzhaogy@xaut.edu.cn
Keywords: Silicon Carbide; Obtuse Triangular Defects; Confocal Microscope; Photoluminescence
Abstract: The obtuse triangular defects would result in higher leakage currents and the preferential gate oxide breakdown of SiC devices.
Forum, 740-742, p.649-652 (2013)
Forum, 679-680, p.123-126 (2011)
Forum, 778-780, p.309-312 (2014)
Forum, 778-780, p.394-397 (2014)
Forum, 740-742, p.649-652 (2013)
Forum, 679-680, p.123-126 (2011)
Forum, 778-780, p.309-312 (2014)
Forum, 778-780, p.394-397 (2014)
Online since: October 2006
Authors: M. Badila, Gheorghe Brezeanu, F. Udrea, G. Amaratunga, Konstantinos Zekentes, C. Boianceanu, M. Brezeanu
Zekentes4
1
Univ. of Cambridge, Trumpington Street, Department of Engineering, CB2 1PZ, Cambridge, UK
2
Catalyst Semiconductor Inc., 1250 Borregas Ave., Sunnyale, California, 94089, USA
3
University "POLITEHNICA" Bucharest, Splaiul Independetei 313, 040011, Bucharest, Romania
4
FORTH, PO BOX 1527, 71110, Heraklion, Crete, Greece
a
mb470@cam.ac.uk
Keywords: High-k Dielectrics, Ramp Oxide Termination, Schottky, Junction Barrier Diode
Abstract.
Mitu: John Wiley Encyclopedia of Electrical and Electronics Engineering Vol. 18 (1999), p. 710 [3] G.
Forum Vol. 389-393 (2002), p. 1301 [4] S.
Agarwal: Advances in Silicon Carbide: Processing and Application (Artec House Inc, 2004) [5] J.
Forum Vol. 457-460 (2004), p. 845
Mitu: John Wiley Encyclopedia of Electrical and Electronics Engineering Vol. 18 (1999), p. 710 [3] G.
Forum Vol. 389-393 (2002), p. 1301 [4] S.
Agarwal: Advances in Silicon Carbide: Processing and Application (Artec House Inc, 2004) [5] J.
Forum Vol. 457-460 (2004), p. 845
Online since: October 2011
MEAEI2011 is a comprehensive conference,and it is an integrated conference concentrating its
focus upon Material Engineering, Architectural Engineering and Informatization .
In the proceeding, you can learn much more knowledge about Material Engineering, Architectural Engineering and Informatization of researchers all around the world.
In order to meet high standard of Advanced Materials Research,the organization committee has made their efforts to do the following things.
The goal of the conference is to provide researchers from Material Engineering, Architectural Engineering and Informatization fields with a free exchanging forum to share the new ideas, new innovation and solutions with each other.
In the proceeding, you can learn much more knowledge about Material Engineering, Architectural Engineering and Informatization of researchers all around the world.
In order to meet high standard of Advanced Materials Research,the organization committee has made their efforts to do the following things.
The goal of the conference is to provide researchers from Material Engineering, Architectural Engineering and Informatization fields with a free exchanging forum to share the new ideas, new innovation and solutions with each other.
Online since: December 2004
Authors: Tai Chiu Lee, S.L. Yim, Kai Ming Yu, D. Kwok
Materials Science Forum Vols. *** (2004) pp.891-894
online at http://scientific.net
Ó 2004 Trans Tech Publications, Switzerland
Taguchi Methods to Optimize TiN Coating Surface Roughness
S.L.
Lee1,d 1 Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong 2 Techmart Platit Limited, Unit 6, 8/F., Block B, Hoi Luen Ind'l Ctr., 55 Hoi Yuen Rd., Kwun Tong, Kowloon, Hong Kong a ann.yim@polyu.edu.hk, bmfkmyu@polyu.edu.hk, cdavid.kwok@platit.com.hk, d mftclee@inet.polyu.edu.hk Keywords: Taguchi method, Optimization, Titanium nitride, PVD coating, Roughness Abstract.
Cutting speed, feed rate, depth of cut, workpieces hardness and cutting tool materials Advances in Materials Manufacturing Science and Technology 892 are variables in the cutting process.
Materials Science Forum Vols. *** 893 Table 2 The L9 Orthogonal array for the experiments [5], Ra value and S/N ratio for each run L9 Ra value (µm) Coating Parameters or factors Trial no.
To investigate the optimal condition when considering roughness Advances in Materials Manufacturing Science and Technology 894 (Ra), a smaller-the-best approach is applied.
Lee1,d 1 Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong 2 Techmart Platit Limited, Unit 6, 8/F., Block B, Hoi Luen Ind'l Ctr., 55 Hoi Yuen Rd., Kwun Tong, Kowloon, Hong Kong a ann.yim@polyu.edu.hk, bmfkmyu@polyu.edu.hk, cdavid.kwok@platit.com.hk, d mftclee@inet.polyu.edu.hk Keywords: Taguchi method, Optimization, Titanium nitride, PVD coating, Roughness Abstract.
Cutting speed, feed rate, depth of cut, workpieces hardness and cutting tool materials Advances in Materials Manufacturing Science and Technology 892 are variables in the cutting process.
Materials Science Forum Vols. *** 893 Table 2 The L9 Orthogonal array for the experiments [5], Ra value and S/N ratio for each run L9 Ra value (µm) Coating Parameters or factors Trial no.
To investigate the optimal condition when considering roughness Advances in Materials Manufacturing Science and Technology 894 (Ra), a smaller-the-best approach is applied.
Online since: May 2007
Authors: Andrew Godfrey, Qing Liu, J. Jiang
Liu
1, c
1
Laboratory of Advanced Materials, Dept of Materials Science and Engineering, Tsinghua
University, Beijing 100084, China.
Forum Vol. 467-470 (2004), p. 1175
Forum Vol. 495-497 (2005), p. 633
Forum Vol. 467-470 (2004), p. 1175
Forum Vol. 495-497 (2005), p. 633