Search results

Keast: Materials Characterization Vol.57(2006),p424 [5] Y.
Kim: Journal of the Korean Institute of Metals and Materials Vol. 42(2004),p.537
Funsho: Indian Journal of Economics and Business Vol. 120(2006),p.130 [7] L.
Keast: Materials Characterization Vol. 57(2006),p.424 [8] B.Yang, L.N.Zhang,J.X.Xie: Special Casting & Nonferrous Alloys Vol. 28(2008),p.235(In Chinese) [9] M.
Luo, et al: Rare Metals Vol.25(2006),p.687 [10] L.R.Xiao, X.P.Shu, D.Q.Yi: Journal of Central South University Vol. 40(2009),p.117

Al-induced crystallization of amorphous silicon film Pingsheng Zhoua, Weimin Shib, Jing Jinc, Jun Qiand, Xiaolei Que, Linjun Wangf School of Material Science and Engineering, Shanghai University, 149 Yanchang Rd., Shanghai, China, 200072 aZpsjx1@hotmail.com, bwmshi@mail.shu.edu.cn, cjjin@shu.edu.cn, dadele1900@126.com, exiaoleiqu@shu.edu.cn, fljwang@mail.shu.edu.cn.
Fuhs:Aluminum-induced crystallization of amorphous silicon , Journal of Non-Crystalline Solids, vol. 299, p. 5, 2002
Shirai:Rapid crystallization of amorphous silicon utilizing a very-high-frequency microplasma jet for Si thin-film solar cells,Solar Energy Materials and Solar Cells, vol. 93, pp. 1154-1157, 2009
Kim:Metal induced crystallization of amorphous silicon by using NiCl2 vapor, Journal of the Korean Physical Society, vol. 51, pp. 84-87, Jul 2007
Lee: Crystallization of silicon films by new metal mediated mechanism, Journal of Materials Science: Materials in Electronics, vol. 21, pp. 270-277, 2009.

Relative activities of deformation modes in AZ31 magnesium alloy predicted by mesoscopic crystalline model De Liang Yin a, Jin Qiang Liu b, Xin Chen c School of Materials Science and Engineering, Nanjing University of Science and Technology Nanjing, 210094, China a d_l_yin@163.com, b jqliu@mail.njust.edu.cn, c coolcoolcx@163.com Keywords: magnesium alloy; mesoscopic model; deformation; relative activity.
Boger, International Journal of Plasticity 23 (2007) 44-86
Mahajan, Progress in Materials Science 39 (1995) 1-157
Uggowitzer, Materials Science and Engineering A. 379 (2004) 258–263
Liu, Journal of Alloys and Compounds 478 (2009)789-795.

Introduction Carbon nanotube (CNT) is one of the attractive reinforcements of the composite materials due to its low density of 1.3 g/cm3 and 973 GPa Young's modulus [1,2].
Experimental Atomized pure Ti powders, having a mean particle size of 30 μm, was used as starting materials.
P/M extruded TMC materials were machined to tensile specimen bars with 3.0mm diameter and 10 mm gauge length, and evaluated at room temperature.
A mean grain size of P/M Ti materials with CNTs and no CNT is around 6μm and 5μm, respectively, and no significant difference between them is observed.
[10] Ouchi, C., Iizumi, H., and Mitao, S. (1998) Effects of ultra-high purification and addition of interstitial elements on properties of pure titanium and titanium alloy, Materials Science and Engineering A 243, 186-195.

Bae,” Finite element analysis on the effect of die clearance on shear planes in fine blanking” Journal of Materials Processing Technology 130–131 (2002) 462–468 [3] X.
Hoffmann , ”FEM simulation and experimental research on the AlMg4.5Mn0.4 sheet blanking” Journal of Materials Processing Technology 122(2002) 338-343 [4] N.
Takakura, “Finite element simulation of the shearing mechanism in the blanking of sheet metal” Journal of Materials Processing Technology 139 (2003) 64–70 [5] H.
Rachik , “Rate-dependent constitutive model for sheet metal blanking investigation” Materials Science and Engineering A 487 (2008)162–170 [6] S.
Murakawa,” An investigation of material flow analysis in fine blanking process” Journal of Materials Processing Technology 192–193 (2007) 237–242 [7] V.

The properties of representative units of porous materials are discussed [3].
Honeycombs are usually used as core materials for sandwich structures due to their high strength-to-weight ratio [4-7].
Sadowski: Computational Materials Science, (2009) p. 45 [8] X.
Vandepitte: Journal Sandwich Structures﹠ Materials, 5, (2006), p.8 [9] M.
Turan: Journal of Composite Materials, 44, (2010), p.22 [10] Q.

Arsecularatne: International Journal of Surface Science and Engineering, vol. 1 (2007), p. 360 [8] Y.
Galzerani and et al.: Journal of Materials Science, vol. 42 (2007), p. 7331 [10] J.
Gray: Diamond and Related Materials, vol. 4 (1995), p. 837 [12] D.
White: Journal of Materials Research, vol. 4 (1988), p. 385 [13] V.
Zerda: Diamond and Related Materials, vol. 17 (2008), p. 84

Journal of Crop Science and Biotechnology. 17 (2014) 221-227
Current Opinion in Solid State and Materials Science. 8 (2004) 397-404
Soil Science Society of America Journal. 42 (1978) 421-428
Journal of Materials Science: Materials in Electronics. 26 (2015) 791-800
Indian Journal of Science and Technology. 7 (2014) 1376-1381

Advanced Materials, 2013, 25(36)
Materials & Design (1980-2015), 2013, 52: 638-647
Materials & Design, 2017, 128: 98-111
Materials & Design, 2019, 164: 107553
Modelling and Simulation in Materials Science and Engineering, 2017, 25(6): 065002

Some measures can be taken to avoid electron gun failure due to resonance, such as replacing the materials, changing the structure of weak links and changing TWT installation to make external incentives along the axial direction (Y direction).
Structure safety analysis should associate the strength index of materials with the maximum working stress of parts in the gun calculated by simulation method.
Some measures can be taken to avoid electron gun failure due to resonance, such as changing welding method, replacing the materials or changing the structure of weak links.
Some measures can be taken to improve the strength of electron, such as changing welding method, replacing the materials or changing the structure of weak links.
References [1] Lijun Zhang, Weihang Han: submitted to Journal of Mechanical Management and Development (2011), In Chinese [2] Mingming Xu, Yi Zeng, Wenqing Liu etc: submitted to Journal of Machinery Design and Manufacture (2012), In Chinese [3] Zhining Jiao: submitted to Journal of Mechatronic Engineering (2013), In Chinese [4] Qinjian Li, Cuizhuo Gao, Guohui Bian: submitted to Journal of Semiconductor Technology (2012), In Chinese [5] Juan Wang, Gang Wu, Xiaogang Su: submitted to Journal of Vacuum Electronics (2012), In Chinese [6] Yong Zhang.