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Maleque1 1Advanced Materials and Surface Engineering Research Unit Department of Manufacturing and Materials Engineering International Islamic University Malaysia, P.O.
Asgari: Journal of Materials Chemistry and Physics Vol. 137 (2013), p. 959-966
Shamanian: Journal of Materials Science Vol. 45 (2010) p. 842-849
Mridha: Journal of Materials Processing Technology Vol. 168 (2005) p. 471-477
Baker: Journal of Materials Science, Vol. 30 (1995), p. 5985-5990, 1995.

Three Dimensional Simulation of Thermal Pad using Nanomaterial, Nano-Silver in Semiconductor and Electronic Component Application Mazlan Mohamed1,*, Rahim Atan2, Mohd Mustafa Al Bakri Abdullah3, Muhammad Iqbal Ahmad1, Mohd Huzaifah Yusoff1, Fathinul Najib Ahmad Saad4 1Faculty of Mechanical Engineering, UiTM Pulau Pinang, 13500 Permatang Pauh, Pulau Pinang, Malaysia 2Faculty of Mechanical Engineering, UiTM Shah Alam, 40000 Shah Alam, Selangor, Malaysia 3Center of Excellence Geopolymer & Green Technology (CEGeoGTech) School of Materials Engineering Universiti Malaysia Perlis 4Faculty of Applied Science, UiTM Pulau Pinang, 13500 Permatang Pauh, Pulau Pinang, Malaysia Email: Mazlan547@ppinang.uitm.edu.my Key Words : Thermal pad, PLCC package, Thermal management, Numerical simulation, Average junction temperature, Nano-Silver .
Factors affecting the chip temperature such as coolant velocity, chip power and thermal conductivity of materials are studied and presented. 2.0 The Numerical Model 2.1 Governing Equations The basic equations describing the flow of fluid are conservation of mass, conservation of momentum and conservation of energy.
The simulation results are obtained with 4 PLCC’s with differences materials between nano-silver and epoxy are presented accordingly. 3.1 Effect of nano-silver material on Junction Temperature 3.1.1 For 4 PLCC, 0.5 W Chip power Figure 2 shows the contour of total temperature for 4 PLCC at 1W for velocities 0.1 and 1 m/s.
Discrete Thermal Sources Flush-Mounted on the Wall, Transactions of the ASME, journal of electronic packaging, Vol. 120, pp 510-514, 1998
Bayazitoglu, Forced convection Cooling Across Rectangular Block, Transactions of the ASME, Journal of Heat Transfer, Vol. 109, pp 321-328,1987

Introduction Acoustic emission (AE) is a naturally-occurring phenomenon in materials, in which the rapid release of energy from localized damage such as cracking generates elastic stress waves within the materials.
Conclusion A continuum-mechanics model for AE wave propagation in layered materials has been examined.
Hamstad, A Review: Acoustic Emission, a Tool for Composite-Materials Studies.
Journal of Acoustic Emission.
Journal of Acoustic Emission, 27, 18-26 (2009)

Kaewkhao1,2,h 1Physics Program, Faculty of Science and Technology, Nakhon Pathom Rajabhat University, Nakhon Pathom, 73000, Thailand 2Center of Excellence in Glass Technology and Materials Science (CEGM), Nakhon Pathom Rajabhat University, Nakhon Pathom, 73000, Thailand 3Informatics Mathematics, Faculty of Science and Technology, Suan Sunandha Rajabhat University, Bangkok 10300, Thailand 4Department of Radiologic Technology, Faculty of Associated Medical Sciences, Chiang Mai University, Chiang Mai, 50200, Thailand 5Department of Physics, Faculty of Mathematics and Natural Sciences, Institut Teknologi Bandung, 40132, Indonesia asunisa_sarachai@hotmail.com, bnatthakridta@gmail.com, cnisakorn.su@ssru.ac.th, dsuchartcmu@gmail.com, ebulli99@windowslive.com, fmtungjai@gmail.com, gmitra.djamal@yahoo.com, hmink110@hotmail.com Keywords: X-ray shielding materials, Barium oxide, Half value layer (HVL) Abstract.
Glass is 100% recyclable and one of the safest packaging materials due to its composition and properties [3,4].
The data obtained in this study should be helpful in potential applications in Pb-free x-ray shielding materials.
Mudahar, Barium–borate–fly ash glasses: As radiation shielding materials, J.
Souga, Calculation of Gamma and Neutron Shielding Parameters for Some Materials Polyethylene-Based, International Journal of Physics and Research. 3 (2013) 33-40

Xu: Journal of Materials Processing Technology, 2007.185: p.147
Journal of Materials Processing Technology, 2003. 143–144,P.612
Journal of Materials Processing Technology, 2003.142,P.609
:Journal of Materials Processing Technology, 2004.153–154,p. 319
Ni: Journal of Materials Processing Technology, 2007. 190,p. 230

Acknowledgements This research is financed by Jiangsu Natural Science Fund (05KJD460044) References [1] R.
Klaus: Journal of Materials Processing Technology Vol.177 (2006), P.2–7
Krahn: Journal of Materials Processing Technology, Vol.177 (2006) P.360–363
Hirt: International Journal of Machine Tools & Manufacture Vol. 48(2008), P.522-531
Yu: The Chinese Journal of Nonferrous Metals Vol.15 No.8(2008), P.1162-1166 [6]Z.Q.

Research on the molten nitrate salt thermal properties based on solar thermal utilization Yang Yang1,a, Xiangchun Liu2,b,* , Xueli Feng3,c, Kaixuan Zhou4,d, Chen’guang Zuo5,e 1,2,3,4,5,School. of Material Science and Engineering, Xi’an University of Science and Technology, China a yyxhfw@126.com, *,b liuxc@126.com, c 1004882377@qq.com, d 1075273887@qq.com, ezuozuoyanyan@163.com * Corresponding author.
Experimental .Experimental Materials and Equipment Sodium nitrate, potassium nitrate and lithium nitrate are analytical grade.
Acknowledgments The work was supported by National Natural Science Foundation of China (Project 51072162 and 51372197) and the Scientific Research Program Funded by Shaanxi Provincial Education Department (Project 14JK1483).
Ma: .Journal of Beijing University of Technology, Vol. 33 (2007) No.1, p.62 [2] Keamey D.
[6] Bradshaw RW, Meeker DE: Journal of Solar Energy Mater9ials, Vol.21 (1990) No.1, p.51 [7] B.

Kamat, Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder alloy composites, Materials Science and Engineering A, 529(2011). 257– 264
Gupta Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes, Materials Science and Engineering, A 423(2006). 166–169
[11] A.A.El-Daly, A.F., S.F.Mansour , M.J.Younis Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance, Materials Science&Engineering A, (2013). 62–71
Gupta, Lead-Free Solder Reinforced with Multiwalled Carbon Nanotubes, Journal of Electronic Materials, 37(7)(2006). 1518-1522
Mohd Salleh, A.M.M.A., M.H.Zan@Hazizi , Flora Somidin , Noor Farhani Mohd Alui , Zainal Arifin Ahmad Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder, Materials Science&Engineering A, (2012). 633–637.

Synthesis, Crystal Structure and Luminescence Property on Cabazoly-Based Zinc Metal Organic Frameworks Ying-jie Zhang, Li-xian Suna and Fen Xub Guangxi Key Laboratory of Information Materials, School of Material Science & Engineering, Guilin University of Electronic Technology, Guilin 541004, China asunlx@guet.edu.cn, bxufen@guet.edu.cn Keywords: Metal-organic framework, Carbazole, Luminescence Abstract.
Luminescent materials are what materials absorb certain wavelength rays and emit different wavelength rays immediately[19].
Schick: Energy & Environmental Science, Vol. 6 (2013), p.818
Llewellyn: ACS Combinatorial Science, Vol. 15 (2013), p.111
Allendorf: Science, Vol. 343 (2014), p.66

The different hardening effect on materials caused by the same amount of creep and plastic deformation can attribute to the difference between the substructures resulted from the different loading history.
Acknowledgments Financial support from the Chinese National Science Foundation through the contract of 10776023 is appreciated.
[7] E.H.Jordan, K.P.Walker, A Viscoplastic Model for Single Crystals, Journal of Engineering Materials and Technology, 114, 19-26. (1992)
Lalwani, Thermodynamics of internal variables in the constitutive of the absolute reaction rate theory, The Journal of Chemical Physics, Vol.67,No.9,pp. 3980-3990
Effects of Prior Creep on Subsequent Plasticity of Type 316 Stainless Steel at Elevated Temperature, Journal of Engineering Materials and Technology, Vol.105,pp. 257-263. (1983). 150 200 250 300 350 0 1 2 3 4 5 pr i or cr eep: 0. 50% pr i or cr eep: 0. 75% pr i or cr eep: 1. 00% pur e t or si on Fig. 6(b) Calculated results of after prior creep )(3 MPaτ (%)3/γ ε 3/γ Cr eep Pl asi t i c Fig.6(a) Experimental results of after prior creep (%)3/γ ε 3/γ Cr eep Pl asi t i c )(3 MPaτ