Influence of Micron-Size Activated Carbon Additions on the Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni (SN100C) Solder Fabricated via Powder Metallurgy Method

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Composite solder has drawn attention improvement in microstructural modification and mechanical properties. This research was done to investigate the influence of activated carbon (AC) particulate on the commercial Sn-Cu-Ni solder system (SN100C) solder alloy. The SN100C+AC composite solder was fabricated via powder metallurgy (PM) technique. In this study, five different AC compositions were chosen; (0, 0.25, 0.5, 0.75 and 1.0 wt. %. This study has shown that composite solder has better properties compared to the monolithic solder alloy. A small amount of AC particulate had improved the physical properties of the composite solder. Microstructural analysis showed that the reinforcement was well distributed along the grain boundaries and no significant influence on the melting point of SN100C. Apart from that, 1.0 wt. % of AC additions results with the highest hardness value compared to the other composition.

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Edited by:

Mohd Mustafa Al Bakri Abdullah, Zarina Yahya, Liyana Jamaludin, Alida Abdullah and Rafiza Abd Razak

Pages:

513-517

Citation:

M. I. Izwan Ramli et al., "Influence of Micron-Size Activated Carbon Additions on the Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni (SN100C) Solder Fabricated via Powder Metallurgy Method", Applied Mechanics and Materials, Vols. 754-755, pp. 513-517, 2015

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April 2015

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$41.00

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[1] V.L. Niranjani, B.S.S.C.R., Vajinder Singh, S.V. Kamat, Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder alloy composites, Materials Science and Engineering A, 529(2011).

DOI: https://doi.org/10.1016/j.msea.2011.09.026

[2] Xiaowu Hu, K.L., Zhixian Min Microstructure evolution and mechanical properties of Sn0. 7Cu0. 7Bi lead-free solders produced by directional solidification, Journal of Alloys and Compounds, 566(2013). 239–245.

DOI: https://doi.org/10.1016/j.jallcom.2013.03.034

[3] Gupta, X.L.Z. a.M., Development of lead-free Sn–0. 7Cu/Al2O3 nanocomposite solders with superior strength, J. Phys. D: Appl. Phys., 41(2008).

[4] Y. Tang , G.Y.L., Y.C. Pan Influence of TiO2 nanoparticles on IMC growth in Sn–3. 0Ag–0. 5Cu–xTiO2 solder joints in reflow process, Journal of Alloys and Compounds, 554(2013). 195-203.

DOI: https://doi.org/10.1016/j.jallcom.2012.12.019

[5] Y. Tang, G.Y.L., Y.C. Pan Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3. 0Ag–0. 5Cu–xTiO2 composite solder, Materials and Design, 55(2014). 574–582.

DOI: https://doi.org/10.1016/j.matdes.2013.10.033

[6] S.M.L. Nai, J.W., M. Gupta Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes, Materials Science and Engineering, A 423(2006). 166–169.

DOI: https://doi.org/10.1016/j.msea.2005.10.072

[7] Y. Tanga, G.Y.L., Y.C. Pan, Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3. 0Ag–0. 5Cu–xTiO2 composite solder, Materials and Design, 55(2014). 574–582.

DOI: https://doi.org/10.1016/j.matdes.2013.10.033

[8] Tsao, L.C., An investigation of microstructure and mechanical properties of novel Sn3. 5Ag0. 5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate, Materials Science and Engineering A, (529)(2011). 41-48.

DOI: https://doi.org/10.1016/j.msea.2011.08.053

[9] K. Mohan Kumar, V.K., Andrew A.O. Tay Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders, Journal of Alloys and Compounds, 450(2008). 229–237.

DOI: https://doi.org/10.1016/j.jallcom.2006.10.123

[10] J. C. Leong , L.C.T., C. J. Fang and C. P. Chu, Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3. 5Ag0. 5Cu composite solder BGA packages with immersion Sn surface finish, J Mater Sci: Mater Electron, 22(2011).

DOI: https://doi.org/10.1007/s10854-011-0327-8

[11] A.A. El-Daly, A.F., S.F. Mansour , M.J. Younis Novel SiC nanoparticles-containing Sn–1. 0Ag–0. 5Cu solder with good drop impact performance, Materials Science&Engineering A, (2013). 62–71.

DOI: https://doi.org/10.1016/j.msea.2013.04.022

[12] S.M.L. Nai, J.W., And M. Gupta, Lead-Free Solder Reinforced with Multiwalled Carbon Nanotubes, Journal of Electronic Materials, 37(7)(2006). 1518-1522.

DOI: https://doi.org/10.1007/s11664-006-0142-9

[13] M.A.A. Mohd Salleh, A.M.M.A., M.H. Zan@Hazizi , Flora Somidin , Noor Farhani Mohd Alui , Zainal Arifin Ahmad Mechanical properties of Sn–0. 7Cu/Si3N4 lead-free composite solder, Materials Science&Engineering A, (2012). 633–637.

DOI: https://doi.org/10.1016/j.msea.2012.07.039