Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si₃N₄) Reinforcement

Abstract:

The effect of micron-size silicon nitride (Si₃N₄) particles additions, up to 1.0 wt. % on Sn-Cu-Ni (SN100C) solder alloy was investigated. Sn-Cu-Ni composite solder were prepared via powder metallurgy (PM) technique. Different percentages of Si₃N₄ (0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added into the alloy. Result revealed that reinforcement was well distributed between the grain boundaries which could positively affect the properties of the composite solder.

• Periodical: Applied Mechanics and Materials (Volumes 754-755)
• Pages: 518-523
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.754-755.518
• Online since: April 2015
• Authors: Mohd Izrul Izwan Ramli, Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Mohd Nazree Derman, Rita Mohd Said, Norhayanti Nasir
• Keywords: Composite Solder, Lead-Free, Microstructure, Silicon Nitride, Sn-Cu-Ni

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