Influence of Silicon Nitride (Si3N4) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder

Norhayanti Mohd Nasir; Norainiza Saud; Mohd Arif Anuar Mohd Salleh; Mohd Nazree B. Derman; Mohd Izrul Izwan Ramli; Rita Mohd Said

doi:10.4028/www.scientific.net/AMM.754-755.530

Paper Titles

In Situ Soldering Process Technique by Synchrotron X-Ray Imaging
p.508

Influence of Micron-Size Activated Carbon Additions on the Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni (SN100C) Solder Fabricated via Powder Metallurgy Method
p.513

Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si₃N₄) Reinforcement
p.518

Optimization on Conventional Photolithography Process of 0.98 μm Gap Design for Micro Gap Biosensor Application
p.524

Influence of Silicon Nitride (Si₃N₄) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder
p.530

Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si₃N₄) Particles
p.535

Organic Solar Cell: An Overview on Performance and Fabrication Techniques
p.540

Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste
p.546

The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste
p.551

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 754-755Influence of Silicon Nitride (Si3N4) Addition on...

Influence of Silicon Nitride (Si₃N₄) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder

Abstract:

This research has investigated the solder performances of Sn-0.7Cu lead-free solder reinforced with silicon nitride (Si₃N₄). The Sn-0.7Cu + Si₃N₄ composite solder were fabricated via powder metallurgy (PM) technique with five different weight percentages (0, 0.25, 0.5, 0.75 and 1.0). Results showed that distribution of Si₃N₄ along the grain boundaries has increased the hardness of the Sn-0.7Cu + Si₃N₄ composite solders compared to monolithic Sn-0.7Cu solder alloy. Addition of Si₃N₄ reinforcement had no significant effect to the melting temperature of the solder. Overall, the entire range of Sn-0.7Cu + Si₃N₄ composition greatly improves the microhardness of the eutectic solder.

You might also be interested in these eBooks

Advanced Materials Engineering and Technology III

View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volumes 754-755)

Pages:

530-534

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.754-755.530

Citation:

Cite this paper

Online since:

April 2015

Authors:

Norhayanti Mohd Nasir*, Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Mohd Nazree B. Derman, Mohd Izrul Izwan Ramli, Rita Mohd Said

Keywords:

Composite Solder, Lead-Free, Powder metallurgy, Silicon Nitride, Sn-0.7Cu

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] J. Shen, Y.C. Chan: Microelectronics Reliability, Vol. 49 (2009), p.223–234.

Google Scholar

[2] J.S. Hwang, Implementing lead-free electronics. McGraw-Hill; (2005), p.10–90.

Google Scholar

[3] A.A. El-Daly, A.E. Hammad: Materials and Design Vol. 40 (2012), p.292–298.

Google Scholar

[4] M.A.A. Mohd Salleh, A.M. Mustafa Al Bakri, M.H. Zan@Hazizi, Flora Somidin Noor Farhani Mohd Alui, ZainalAriﬁn Ahmad: Materials Science & Engineering A, Vol. 556 (2012), p.633–637.

DOI: 10.1016/j.msea.2012.07.039

Google Scholar

[5] S.M.L. Nai, J. Wei, M. Gupta: Materials Science and Engineering A, Vol. 423 (2006), p.166–169.

Google Scholar

[6] L.C. Tsao, S.Y. Chang, Mater. Des., Vol. 31 (2010), p.990–993.

Google Scholar

[7] L.C. Tsao, S.Y. Chang, C.I. Lee, W.H. Sun, C.H. Huang, Mater. Des., Vol. 31 (2010), p.4831–4835.

Google Scholar

[8] X.L. Zhong, M. Gupta, J. Phys. D: Appl. Phys., Vol. 41 (2008), p.095403–095409.

Google Scholar

[9] M. Felberbaum, T. Ventura, M. Rappaz, and A.K. Dahle, Electronic Materials Solidification, Vol. 63 pp.56-59.

Google Scholar

[10] Satyanarayan, K.N. Prabhu: Advances in Colloid and Interface Science, Vol. 166 (2011), p.87–118.

Google Scholar

[11] H. Mavoori, S. Jin: J Electron Mater, Vol. 27 (1998), p.1216–22.

Google Scholar

[12] A.K. Gain, Y.C. Chan, K.C. Winco K.C. Yung: Microelectronics Reliability Vol. 51 (2011), p.975–984.

Google Scholar

[13] M.A.A.M. Salleh, A.M.M. Al Bakri, F. Somidin, A.V. Sandu, N. Saud, H. Kamaruddin, S.D. McDonald, K. Nogita, A comparative study of solder properties of Sn-0. 7Cu lead-free solder fabricated via the powder metallurgy and casting methods, Revista de Chimie (Bucharest), 64, 7 (2013).

Google Scholar